October 2021 - Msepostdoc-list

ARMS MSEE Lab Access
by Jennifer Louise Fifer 30 Oct '21

30 Oct '21

Hi All, If you requested lab access this week, it will be delayed. As of Friday morning, I am not able to access anything that depends on Boilerkey and therefore, can access Brightspace or ACT. When the issue is resolved, I will try my best to get you access asa quickly as possible. Have a good weekend, Jenni

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FW: Purdue Engineering Distinguished Lecture Series Lecture & Panel | Dr. Ravi Mahajan Nov. 4, Thursday, 2:30 pm
by Morgan, Yuan-Yu Karen 29 Oct '21

29 Oct '21

Please consider attending this interesting lecture! You can register by clicking the button at the bottom. [https://mailimages.purdue.edu/spacer.gif]<https://maillinks.purdue.edu/t/42146323/1413817987/83756413/0/120588/?72f79…> View as a Web page<https://maillinks.purdue.edu/t/42146323/1413817987/88671575/0/120588/?b44ed…> [Purdue University] PURDUE ENGINEERING DISTINGUISHED LECTURE SERIES: The Coming “Not-So-Quiet” Revolutions: How Advanced Packaging Will Shape the Semiconductor Industry [Ravi Mahajan] Ravi Mahajan Intel Fellow, High Density Interconnect Pathfinding, Assembly Technology, Intel Corporation ASME Fellow, IEEE Fellow; VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT Hosted by College of Engineering, Mechanical Engineering, and Electrical and Computer Engineering LECTURE: The Coming “Not-So-Quiet” Revolutions: How Advanced Packaging Will Shape the Semiconductor Industry<https://maillinks.purdue.edu/t/42146323/1413817987/88651944/0/120588/?f5d63…> Time: 2:30-3:30 p.m. EDT Date: November 4, 2021 PANEL: The Future of Microchips<https://maillinks.purdue.edu/t/42146323/1413817987/88651945/0/120588/?f5d63…> Time: 3:45-4:45 p.m. EDT Date: November 4, 2021 Register<https://maillinks.purdue.edu/t/42146323/1413817987/88676381/1/120588/?f5d63…> Shop<https://maillinks.purdue.edu/t/42146323/1413817987/78175239/0/120588/?x=1c6…> | Visit<https://maillinks.purdue.edu/t/42146323/1413817987/78217797/0/120588/?x=427…> | Give<https://maillinks.purdue.edu/t/42146323/1413817987/78217799/0/120588/?x=1fb…> Forward to a Friend<https://maillinks.purdue.edu/t/42146323/1413817987/88643914/0/120588/?abb9e…> | Unsubscribe from this list<https://maillinks.purdue.edu/t/42146323/1413817987/83756416/0/120588/?c1e99…> | Unsubscribe from all lists<https://maillinks.purdue.edu/t/42146323/1413817987/83756417/0/120588/?e4eaa…> | Privacy Policy<https://maillinks.purdue.edu/t/42146323/1413817987/66794847/0/120588/?x=1ed…> This email was sent to: carolh(a)purdue.edu<mailto:carolh@purdue.edu> This email was sent by: Purdue University 610 Purdue Mall West Lafayette, IN 47906 765-494-4600 [https://mailimages.purdue.edu/purdueuniversity/PU_SIG_Logo_RGB__PU-H-Full-R…]<https://maillinks.purdue.edu/t/42146323/1413817987/71786932/0/120588/?x=07a…>

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**Last Day to Enter** Pet Poster Contest
by Ku Blanco, Aury Y 29 Oct '21

29 Oct '21

Your pet could be featured on "Shut the Sash" safety postings in ARMS fume hoods! The MSE Safety Committee and MSEGSA are working together to improve fume hood safety in ARMS labs. We want pictures of your pets to feature on posters reminding researchers to shut the sashes on fume hoods. This idea has already been implemented to great success (and fun) at KEPN (see image below). [cid:DF46D93A-002A-4DF3-A0B4-7C651B635D3D] Contest rules: * All MSE students, faculty, and staff are eligible * The submitter must be the owner of the pet or have the owner's permission * Both portrait and landscape pet photos are welcome Submit your best pet photo between October 18th and October 29th here: https://purdue.ca1.qualtrics.com/jfe/form/SV_3dRbBuD7ZgNfXwi Voting for the people's choice favorites will take place November 1st-5th in a Qualtrics link to follow! Winners will be recognized and have the opportunity to pick their pet's fume hood. Thank you for participating and sharing pictures of your pets with us! Kerry-Ann Stirrup and Caitlin Adams, MSEGSA Safety Co-Chairs and the MSE Safety Committee

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Final Exam Seminar
by Morgan, Yuan-Yu Karen 29 Oct '21

29 Oct '21

Please consider attending this seminar: MATERIALS ENGINEERING SEMINAR "Phase Transformations in Multicomponent Systems for Solder Joint Reliability" By Alyssa Yaeger Purdue MSE Ph.D. Final Exam Advisors: Professor Carol Handwerker and Professor John Blendell ABSTRACT Solder joints serve as the physical and electrical connection between surface mounted components and circuit boards, and are expected to maintain that connection under stress. Shear stresses due to coefficient of thermal expansion (CTE) mismatch between component and circuit board are common during use, and can lead to fracture of the solder joint. The cracks begin near the solder-substrate interface and propagate through the joint, either through the bulk of the solder or along the interfaces of brittle phases. Therefore, the morphology of the interfacial intermetallic compounds (IMCs) can influence the crack path and whether the failure is ductile or brittle, and thus will determine the lifetime and reliability of the solder joint. Gold embrittlement has been a soldering issue for decades, although it is a broad category which indicates brittle failure due to the presence of gold, typically forming AuSn4. Mitigation of this has included the reduction of Au in the solder joint and the introduction of Cu to destabilize AuSn4-type intermetallics with the formation of (Cu,Ni,Au)6Sn5. A limit of 3wt% Au per solder joint attempted to mitigate this issue, but the methods of gold removal are not precise, and 3% is not a hard limit below which gold embrittlement does not occur. Nickel is able to substitute for Au in AuSn4, forming (Au,Ni)Sn4 in higher volumes at lower gold concentrations, making the establishment of a limit for Au in the joint more difficult. Two methods of establishing these limits are presented in this thesis: isothermal annealing, and thermal cycling. Microstructures evolve over time, even during periods of storage prior to use. Isothermal annealing above storage temperature and below the solidus promotes faster diffusion than seen in practice, due to the temperature dependence of solid state diffusion. This is also known as accelerated aging, as the time and temperature during annealing can be correlated to a different time and temperature during storage. Isothermal annealing allows potential issues, such as gold embrittlement, to be identified more quickly and prior to production, and can give an estimate of product lifetime. For Au-containing solder, Au from the bulk diffuses to the Ni interface to form (Au,Ni)Sn4 during annealing, which causes brittle failure when it forms a thick, continuous layer. Thermal cycling is another method of accelerated testing which can determine the limits of gold embrittlement. Solder joints undergo thermal cycling during product use, and this method increases the cycle frequency to induce earlier failure. This failure is determined by an increase in electrical resistance across solder joints. Failed solder joints can then be cross sectioned to examine the microstructure and crack path to determine cause of failure. Leadless ceramic chip carriers are stiff components with a low standoff height which tends to concentrate thermal expansion mismatch induced stresses in the solder and have thick Au coating, which together make them a good candidate for studies of gold embrittlement. In this thesis, it was determined that these solder joints failed in a ductile manner, determined more by the component characteristics and not as a result of gold embrittlement. A potential mitigation method for gold embrittlement in eutectic Sn-Pb solder joints is also presented in this thesis. Because one cause of gold embrittlement includes the thick, continuous layer of (Au,Ni)Sn4,it has been proposed that breakup of this layer can increase ductility and solder joint lifetime. This can be accomplished with a secondary reflow, or melting, of the solder, using the high solubility of Au in molten solder to destabilize the (Au,Ni)Sn4 and return the solder joint to a more ductile microstructure. The thermodynamics of and mechanisms leading to the destabilization of (Au,Ni)Sn4 are quantified as a function of Au concentration in the solder. The relationship between the solder compositions and microstructure, including interfacial intermetallics, and the fracture behavior of the resulting joints provides insight into the appropriate limits of Au in Sn-Pb solder joints to reduce Au embrittlement. . Date: Monday, November 22, 2021 Time: 9:00 A.M. Place: HAMP 2118

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FW: EEE grad seminar, Nov 2, 10:30AM via zoom
by Son, Rosemary E 29 Oct '21

29 Oct '21

From: Cates, Cresta L Sent: Friday, October 29, 2021 7:20 AM To: Filley, Rose M. <rfilley(a)purdue.edu>; Lee, Linda S <lslee(a)purdue.edu>; Sharma, Pankaj <sharma(a)purdue.edu>; Williams, LeAnne E <lewillia(a)purdue.edu>; Sherwood, Audrey H <asherwo(a)purdue.edu>; Peer, Rebecca J. <peerb(a)purdue.edu>; Gelfand, Johanna K <jo(a)purdue.edu>; Turner, Carmen S <turne148(a)purdue.edu>; Guerrero, Betty Lou <blg(a)purdue.edu>; Sondgeroth, Bonnie <bonniek(a)purdue.edu>; Hays, Cindey A <isenberg(a)purdue.edu>; Jurss, Karen L <kjurss(a)purdue.edu>; Dellinger, Leza R <lrdellin(a)purdue.edu>; Baumgardt, Jacqueline C. <jackieb(a)purdue.edu>; Reece, Kellie A <kreece(a)purdue.edu>; Son, Rosemary E <son39(a)purdue.edu> Subject: EEE grad seminar, Nov 2, 10:30AM via zoom Please share with your faculty and students. Cresta Cates she/her/hers Graduate Administrative Assistant, Environmental and Ecological Engineering Potter Engineering Center, 500 Central Drive, Room 364, West Lafayette, IN 47907 o: 765-496-0545 [FF65F699]<https://www.purdue.edu/?utm_source=signature&utm_medium=email&utm_campaign=…> From: Eeegraduatestudents-list <eeegraduatestudents-list-bounces(a)ecn.purdue.edu<mailto:eeegraduatestudents-list-bounces@ecn.purdue.edu>> On Behalf Of Cates, Cresta L Sent: Friday, October 29, 2021 7:16 AM To: EEEgraduatestudents-list(a)ecn.purdue.edu<mailto:EEEgraduatestudents-list@ecn.purdue.edu>; eee-faculty-list(a)ecn.purdue.edu<mailto:eee-faculty-list@ecn.purdue.edu>; eee-friends(a)ecn.purdue.edu<mailto:eee-friends@ecn.purdue.edu> Cc: Sutherland, John W <jwsuther(a)purdue.edu<mailto:jwsuther@purdue.edu>>; Whelton, Andrew J <awhelton(a)purdue.edu<mailto:awhelton@purdue.edu>> Subject: [EEEGradStudents] EEE grad seminar, Nov 2, 10:30AM via zoom [cid:image004.jpg@01D7CC94.DB2FFBA0] Cresta Cates she/her/hers Graduate Administrative Assistant, Environmental and Ecological Engineering Potter Engineering Center, 500 Central Drive, Room 364, West Lafayette, IN 47907 o: 765-496-0545 [FF65F699]<https://www.purdue.edu/?utm_source=signature&utm_medium=email&utm_campaign=…>

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MSEGSA Halloween Costume Contest
by Benjamin Thomas Stegman 28 Oct '21

28 Oct '21

Hi All, In the spirit of Halloween, MSEGSA is putting on a Halloween Costume Contest on this coming Friday, 10/29, as a way of having some fun in the middle of the semester. Since there is no MSE 690 seminar on that Friday, we are planning to use ARMS 1010 as a sort of "runway" to model the spooky and silly costumes. The event will begin at 3:30PM and we will have some various pre-packaged candies for everyone to take home with them. Prizes for the top 3 are a $20 gift card of their choice, a $10 gift card of their choice, and an official MSEGSA mug, respectively. We would love 3-4 judges to rate all of the costumes and we figured the best people suited would be our professors, with their many years of trick-or-treating. So, if any professor is willing to take about an hour out of their schedule on Friday and partake in this fun event, we would really appreciate it! If you are interested, please reach out to me, and hope to see everyone there next Friday! Regards, Benjamin T. Stegman He/Him/His Ph.D. Candidate Materials Engineering Graduate Student Association President Materials Engineering Purdue University (513) 680-8121

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Preliminary Exam Seminar
by Morgan, Yuan-Yu Karen 28 Oct '21

28 Oct '21

Please consider attending this seminar: MATERIALS ENGINEERING SEMINAR "Mechanical Properties and Deformation Mechanisms of Ball Milled Nanocrystalline Al Alloys" By Xuanyu Sheng Purdue MSE Preliminary Exam Advisor: Professor Xinghang Zhang ABSTRACT Nanocrystalline aluminum alloys have gained specific interest in aerospace and automotive industries as they exhibit superior mechanical properties when comparing with their coarse grain counterparts. Mechanical milling (also referred to as ball milling frequently) is an effective method to produce nanostructured metals and composite powders and has been commonly employed to prepare nanocrystalline aluminum alloys. Ball milling techniques also promote significant grain refinement and alloying at atomic level, thus give rise to the significant improvement of mechanical properties. In this report, the microstructure, mechanical properties, and deformation mechanisms of ball-milled nanocrystalline aluminum alloy are discussed. When the grain size of nanocrystalline Al is below a critical value, competition of different deformation mechanisms may occur. The proposed models shed light on improving the mechanical properties of nanocrystalline aluminum alloys. Date: Nov 1, 2021 Time: 1:00 PM WebEx: https://purdue.webex.com/meet/xzhang98 Yuan-Yu Karen Morgan,Ph.D. Academic Advisor-Graduate Program School of Materials Engineering Neil Armstrong Hall of Engineering, Room 2217 765-494-4103 ymorgan(a)purdue.edu<mailto:ymorgan@purdue.edu>

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FW: ME Distinguished Seminar Series: Hawkins Lecture 10/28/21
by Stacey, Lisa A 28 Oct '21

28 Oct '21

Forwarding on behalf of Mechanical Engineering, reminder of today’s Distinguished Lecture, Dr. John Bischof, Depts. of Mechanical and Biomedical Engineering, Univ. of Minnesota Lisa Stacey Administrative Assistant to the Department Head School of Materials Engineering Neil Armstrong Hall of Engineering o: 765-494-4095 f: 765-494-1204 [3749DD84]<https://urldefense.proofpoint.com/v2/url?u=https-3A__www.purdue.edu_-3Futm-…> ________________________________ [cid:image002.png@01D7CBD9.A87F0F40]

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FW: Chemistry Analytical Seminar, Tuesday, Oct 26, 2021
by Son, Rosemary E 25 Oct '21

25 Oct '21

From: Hanna, Thomas J Sent: Monday, October 25, 2021 7:52 AM To: Mechanical Engineering Graduate Office <megradoffice(a)purdue.edu>; Elwell, Cathy L <celwell(a)purdue.edu>; Golden, Matt <goldenm(a)purdue.edu>; Ricksy, Jennifer R <jricksy(a)purdue.edu>; Zimmerman, Nicole K <nzimmerm(a)purdue.edu>; Son, Rosemary E <son39(a)purdue.edu>; Johnson, Beverly J <bevjohnson(a)purdue.edu>; Delaney, Morgan J <mdelane(a)purdue.edu> Subject: Chemistry Analytical Seminar, Tuesday, Oct 26, 2021 Please distribute the attached Analytical Seminar announcement for Tomorrow, Tuesday, Oct 26, 2021 ASAP in your respective areas or departments. Thank you, Tom Hanna Administrative Assistant to: Analytical Division of Chemistry Professors Claridge, Kenttämaa, A. Laskin, J. Laskin, McLuckey, Simpson, Wirth, C. Zhang Organic Division of Chemistry Professors Axelrod, Chmielewski, Lipton, Mao, Mei, Sintim Department of Chemistry BRWN 5171A Purdue University 560 Oval Drive West Lafayette, IN 47907-2084 hanna9(a)purdue.edu<mailto:hanna9@purdue.edu> 765-494-5267

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MSE 690 Oct 22 Susana Diaz-Amaya, WebEx, 3:30 PM
by Ku Blanco, Aury Y 22 Oct '21

22 Oct '21

Hi all, Please join us today at 3:30 PM (WebEx Link<https://purdue.webex.com/purdue/j.php?MTID=md69cee28213ddab33cabd21a00adb502> | Password: mse1022). [cid:22b47a12-8b65-4874-8131-3df651b68e7b] Best, Aury Ku she/her/hers Administrative Assistant Materials Engineering Neil Armstrong Hall of Engineering 701 W Stadium Ave, ARMS 2300 West Lafayette, IN 47906 o: 765-494-4100 f: 765-494-1204

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