July 2018 - Msepostdoc-list

Fwd: UPDATE: Northwestern Avenue Parking Garage Closure Postponed
by Donna Bystrom 26 Jul '18

26 Jul '18

*UPDATE:*Northwestern Avenue Parking Garage Closure Postponed <https://www.purdue.edu/physicalfacilities/news/2018/071918-pgnw-closure.html> Thanks, Phil *From:* Qualio, Phillip H *Sent:* Thursday, July 19, 2018 2:54 PM *Subject:* FW: Physical Facilities Connection – July 19, 2018 FYI — Northwestern Avenue Parking Garage Closes 6:00-PM July 27; Fully Reopens July 30 with Restored Traffic Flow <https://www.purdue.edu/physicalfacilities/news/2018/071918-pgnw-closure.html> Thanks, Phil Qualio Building Deputy Neil Armstrong Hall of Engineering Potter Engineering Center 765.496.9757 — 765.494.7020 *From:* Clendenning, Amanda M <clendenning(a)purdue.edu <mailto:clendenning@purdue.edu>> *Sent:* Thursday, July 19, 2018 2:41 PM *Subject:* Physical Facilities Connection – July 19, 2018 cid:image003.png@01CF655A.1BCC4E70 <https://www.purdue.edu/physicalfacilities/pfconnection/recent-news/index.ht…> Contact Us <mailto:rmkiefer@purdue.edu;rlterry@purdue.edu> News from Physical Facilities for Building Deputies – July 19, 2018 *Construction Notices* ·Northwestern Avenue Parking Garage closes 6 p.m. July 27; fully reopens July 30 with original traffic flow restored <https://www.purdue.edu/physicalfacilities/news/2018/071918-pgnw-closure.html> ·State Street from S. University Street to Russell Street closed July 21 <https://statestreetwl.com/project-news-updates/2018/7/19/state-street-from-…> ·Restrictions on Pierce Street through August 10 <https://www.purdue.edu/physicalfacilities/news/2018/071918-pierce-st-restri…> *Recent News* ·Faculty, staff, students can purchase parking permits now; optional open labs this week <https://www.purdue.edu/physicalfacilities/news/2018/071918-parking-permits.…> ·Review, update building deputy directory contact information <https://www.purdue.edu/physicalfacilities/news/2018/071918-bd-updates.html>

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Reminder: MSE Guest Speaker Dr. Thomas Hochrainer Friday, July 27, 2018 ARMS 1021, Coffee/Snacks, 10:30am - Seminar, 11:00am
by Coar, Stacey L 26 Jul '18

26 Jul '18

[X] Stacey Stacey Coar Secretary/Development Assistant School of Materials Engineering Purdue University Neil Armstrong Hall of Engineering 701 West Stadium Ave. Room 2300 West Lafayette, IN 47907 765-494-4100 scoar(a)purdue.edu<mailto:scoar@purdue.edu>

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Reminder: MSE Guest Speaker Dr. Edwin Chan Friday, July 27, 2018 ARMS 1028, Coffee/Snacks, 10:30am - Seminar, 11:00am
by Coar, Stacey L 26 Jul '18

26 Jul '18

[content://com.samsung.android.email.attachmentprovider/1/6117/RAW] Stacey Stacey Coar Secretary/Development Assistant School of Materials Engineering Purdue University Neil Armstrong Hall of Engineering 701 West Stadium Ave. Room 2300 West Lafayette, IN 47907 765-494-4100 scoar(a)purdue.edu<mailto:scoar@purdue.edu>

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FW: Graduate Student Clothing and Toy Exchange
by Son, Rosemary E 25 Jul '18

25 Jul '18

Please share with Graduate Students, Faculty and Staff! The Office of Interdisciplinary Graduate Programs and the Purdue Graduate Student Government would like to invite you to participate in the first annual graduate student clothing and toy exchange! We would like to invite faculty, staff and graduate students to donate: Gently used clothing for all seasons Children's toys Small pieces of furniture Household items Donations will be accepted at the Purdue Graduate Student Center (PGNW): July 25th to August 17th 10:00 AM - 6:00 PM All graduate students, both current and incoming, are welcome to check out the exchange and pick up any items they need. The exchange will be held at the Purdue Graduate Student Center (PGNW) on the following dates: August 18th, 19th, and 20th 10:00 AM-12:00 PM and 2:00 PM-4:00 PM Any items that have not been picked up by 4 PM on August 20th will be donated to Goodwill. Give what you can and take what you need, or just stop by and meet your fellow graduate students! For more information, contact oigp(a)purdue.edu<mailto:oigp@purdue.edu>. Christal Musser Assistant Director Office of Interdisciplinary Graduate Programs The Purdue University Graduate School | Purdue University Ernest C. Young Hall, Room B-40 | 155 S. Grant Street | West Lafayette, IN 47907 Email: musser(a)purdue.edu<mailto:musser@purdue.edu> | Web: www.purdue.edu/ese<http://www.purdue.edu/ese> Phone: 765-494-2102 | Fax: 765-496-6271

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MSE Guest Speaker Dr. Edwin Chan Friday, July 27, 2018 ARMS 1028, Coffee/Snacks, 10:30am - Seminar, 11:00am
by Coar, Stacey L 25 Jul '18

25 Jul '18

[cid:image001.png@01D423F7.0AFE01A0] Stacey Stacey Coar Secretary/Development Assistant School of Materials Engineering Purdue University Neil Armstrong Hall of Engineering 701 West Stadium Ave. Room 2300 West Lafayette, IN 47907 765-494-4100 scoar(a)purdue.edu<mailto:scoar@purdue.edu>

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Recall: MSE Guest Speaker Dr. Thomas Chan Friday, July 27, 2018 ARMS 1028, Coffee/Snacks, 10:30am - Seminar, 11:00am
by Coar, Stacey L 25 Jul '18

25 Jul '18

Coar, Stacey L would like to recall the message, "MSE Guest Speaker Dr. Thomas Chan Friday, July 27, 2018 ARMS 1028, Coffee/Snacks, 10:30am - Seminar, 11:00am".

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Seminar Remind for Hector Morales's Ph.D. Final Exam. Seminar, Wednesday, July 25, at 1:00, in ARMS B071; Exam same day at 2:00, in ARMS 2326. " Antimicrobial Peptide Adsorption and Storage on Oxidized Metal Surfaces to Mitigate Bacterial Attachment"
by Son, Rosemary E 24 Jul '18

24 Jul '18

Please consider attending the following: MATERIALS ENGINEERING SEMINAR "Antimicrobial Peptide Adsorption and Storage on Oxidized Metal Surfaces to Mitigate Bacterial Attachment" By Jesus Hector Morales Espejo Purdue MSE Ph.D. Final Exam Advisor: Professor David F. Bahr ABSTRACT Food safety has become an important issue globally due to increasing foodborne diseases and changes in food habits. The occurrence of illness due to consumption of foods contaminated by bacteria has a great impact on public health worldwide. Only during June 2018, the Center for Disease Control has reported 160 hospitalizations and 5 deaths in USA as a result of foodborne diseases. Although some food products can come contaminated from the farm, it has been demonstrated that in most cases the food gets contaminated in the food processing plant or in food retailers when in contact with contaminated surfaces like slicers, conveyors, knives, carts, blades, etc. In an effort to mitigate this problem, the present work aims to design an antibacterial surface by combining the use of an antimicrobial agent and surface modification. Pulsed laser oxidation was used to form oxide layers on Ti-6Al-4V and 304L stainless steel under atmospheric conditions. Analysis of cross sections revealed that these artificially created colored oxide layers vary in thickness and exhibit cracks which penetrate between 1 - 6 μm into the substrate. These fine surface cracks have been used as a reservoir for storing nisin, an antimicrobial peptide with high activity against a broad spectrum of Gram-positive bacteria. The antibacterial efficacy against Listeria monocytogenes and the response of the surface to mechanical impact were evaluated, confirming that nisin remains in the layer and still displays good antibacterial activity. Release kinetics tests demonstrated that nisin is desorbed from the cracks only when the oxide layer is submitted to acidic pH, and sustained washing and wear does not remove the nisin. This suggests nisin-infused microcracked surfaces are viable for creating antibacterial food-contact surfaces, preventing the spread of foodborne pathogens. Date: Wednesday, July 25, 2018 Time: 1:00 P.M. Place: ARMS B071

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MSE Guest Speaker Dr. Thomas Hochrainer Friday, July 27, 2018 ARMS 1021, Coffee/Snacks, 10:30am - Seminar, 11:00am
by Coar, Stacey L 24 Jul '18

24 Jul '18

[cid:image001.png@01D42330.B6436720] Stacey Stacey Coar Secretary/Development Assistant School of Materials Engineering Purdue University Neil Armstrong Hall of Engineering 701 West Stadium Ave. Room 2300 West Lafayette, IN 47907 765-494-4100 scoar(a)purdue.edu<mailto:scoar@purdue.edu>

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Seminar Notice for Hector Morales's Ph.D. Final Exam. Seminar, Wednesday, July 25, at 1:00, in ARMS B071; Exam same day at 2:00, in ARMS 2326. " Antimicrobial Peptide Adsorption and Storage on Oxidized Metal Surfaces to Mitigate Bacterial Attachment"
by Son, Rosemary E 20 Jul '18

20 Jul '18

Please consider attending the following: MATERIALS ENGINEERING SEMINAR "Antimicrobial Peptide Adsorption and Storage on Oxidized Metal Surfaces to Mitigate Bacterial Attachment" By Jesus Hector Morales Espejo Purdue MSE Ph.D. Final Exam Advisor: Professor David F. Bahr ABSTRACT Food safety has become an important issue globally due to increasing foodborne diseases and changes in food habits. The occurrence of illness due to consumption of foods contaminated by bacteria has a great impact on public health worldwide. Only during June 2018, the Center for Disease Control has reported 160 hospitalizations and 5 deaths in USA as a result of foodborne diseases. Although some food products can come contaminated from the farm, it has been demonstrated that in most cases the food gets contaminated in the food processing plant or in food retailers when in contact with contaminated surfaces like slicers, conveyors, knives, carts, blades, etc. In an effort to mitigate this problem, the present work aims to design an antibacterial surface by combining the use of an antimicrobial agent and surface modification. Pulsed laser oxidation was used to form oxide layers on Ti-6Al-4V and 304L stainless steel under atmospheric conditions. Analysis of cross sections revealed that these artificially created colored oxide layers vary in thickness and exhibit cracks which penetrate between 1 - 6 μm into the substrate. These fine surface cracks have been used as a reservoir for storing nisin, an antimicrobial peptide with high activity against a broad spectrum of Gram-positive bacteria. The antibacterial efficacy against Listeria monocytogenes and the response of the surface to mechanical impact were evaluated, confirming that nisin remains in the layer and still displays good antibacterial activity. Release kinetics tests demonstrated that nisin is desorbed from the cracks only when the oxide layer is submitted to acidic pH, and sustained washing and wear does not remove the nisin. This suggests nisin-infused microcracked surfaces are viable for creating antibacterial food-contact surfaces, preventing the spread of foodborne pathogens. Date: Wednesday, July 25, 2018 Time: 1:00 P.M. Place: ARMS B071

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Seminar Reminder for John Holaday's Ph.D. Final. Seminar, July 19, at 9:00 a.m., in HAMP 2123; Exam same day, at 10:00, in ARMS 2222. " Transient Liquid Phase Bonding for High Temperature Interfaces"
by Son, Rosemary E 18 Jul '18

18 Jul '18

Please consider attending the following: MATERIALS ENGINEERING SEMINAR "Transient Liquid Phase Bonding for High Temperature Interfaces" By John R. Holaday Purdue MSE Ph.D. Final Exam Advisor: Professor Carol A. Handwerker ABSTRACT Transient liquid phase bonding (TLPB) is a type of interdiffusion bonding between metals that has been proposed for a variety of electronic interconnect applications. TLPB takes advantage of the formation of solid intermetallic compounds (IMC) formed by interdiffusion between a liquid phase, low-melting temperature component, such as Sn or a Sn alloy, and a solid, high-melting temperature component, such as Cu, Ni, or Ag. In conventional soldering, relatively thin layers of IMC form at interfaces and are dispersed in the bulk of the solder which has been heated above the liquidus temperature of the solder alloy and solidified by cooling. In TLPB, isothermal solidification occurs by the complete consumption of the low-melting temperature phase in the formation of IMC. Under the correct conditions, the resulting IMCs will exhibit a melting temperature greater than the initial processing temperature. The elevated melting temperature of the IMC is intended to facilitate high temperature operation and hierarchical device fabrication. A framework for interpreting equilibrium binary and ternary phase diagrams to predict non-equilibrium TLPB behavior was implemented. Detailed thermodynamic data in the form of calculated phase diagram (CALPHAD) databases exist for a broad set of Sn alloys. This framework was applied to screen potential TLPB formulations from a larger design space. Ternary diagrams were generated at regular temperature intervals using Thermo-Calc to compare outcomes over possible processing temperature ranges. Evaluations of binary and ternary phase diagrams are presented for several Sn alloys with Ag, Cu, and Ni as the high-melting temperature phase. Known interfacial reaction products were also discussed to demonstrate circumstances in which a different phase is known to form than that expected based on the proposed thermodynamic interpretation method. This analysis was performed to provide insights into potential TLPB formulations regarding effective composition ranges, resulting phases, processing temperatures, and operating temperature ranges. Application of the thermodynamic framework lead to the identification of a novel Bi-rich, Sn-Bi-Cu TLPB formulation. The relatively low eutectic temperature (139°C) of Sn-Bi is an attractive characteristic for use in TLPB, specifically where low temperature processing is desirable. Ideally, the melting temperature and thus the maximum operating temperature is elevated to that of the precipitated Bi phase(~271°C) that forms after Sn is consumed by the formation of Cu6Sn5 and Cu3Sn. Previous investigations of Sn-Bi TLPB focused on characterizing the reaction of eutectic Sn-Bi and Sn-rich, Sn-Bi with Cu. Unfortunately, eutectic Sn-Bi reacted with Cu results in a persistent melting event at 200°C due to the presence of Cu6Sn5. Analysis of the ternary phase diagrams and invariant reactions in the Cu-Sn-Bi ternary reveal that a shift in the IMC phase in equilibrium with Bi causes a liquid forming reaction at 200°C. This reaction can be avoided by using a Bi-rich, Sn-Bi composition such that Cu3Sn forms at the Cu-SnBi interface as opposed to a layered Cu6Sn5 and Cu3Sn structure. The concept of processing regimes and processing regime maps was introduced as a method to clarify description of the temperature and composition ranges resulting in the same processing outcomes. Experimental assessment of Bi-rich, Sn-Bi was performed with Cu and Ni. Interfacial reactions between Sn-80Bi (wt. %) and Cu substrates confirmed the direct formation Cu3Sn. Planar TLPB assemblies were fabricated by quickly soldering together substrates in a planar configuration with a bondline thickness of 10 to 20µm. These assemblies were then thermally processed using the DSC, cross-sectioned, polished, and examined via SEM. DSC and and EDS confirmed complete isothermal solidification in less than 60 minutes at 300°C. Solid-liquid interfacial reaction couples were also processed in a tube furnace. Interfacial reactions were tested to confirm the viability of Bi-rich Sn-Bi where Ni interfaces will be bonded. Experimental results demonstrated that Sn-Bi-Cu is a practical TLPB system when a Bi-rich low-melting temperature phase is processed above 200°C. Transient liquid phase bonding is a compelling method for forming high temperature interconnects. The thermodynamic framework developed for TLPB design establishes the opportunity for additional novel formulations to be developed. Bi-rich, Sn-Bi with Cu has been demonstrated to be a novel, thermodynamically viable TLPB system. Although further development will be needed to characterize and refine mechanical performance. Date: Thursday, July 19, 2018 Time: 9:00 A.M. Place: HAMP 2123 PURDUE MSE [cid:image003.png@01D41EB7.05B5B570]

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