November 2024 - Bnc-grads-list

Coffee Hour Cancelled
by Nanotechnology Student Advisory Council, 08 Nov '24

08 Nov '24

Hey everyone, Coffee hour is canceled today due to the "2024 Symposium on Reliability for Electronics and Photonics Packaging" going on in BIRCK. Join the NSAC WhatsApp group for the most up-to-date information: https://chat.whatsapp.com/CX8iFkb95HvJ4GKo6LTrEg<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fchat.what…> [cid:c842fef6-6ee4-425d-89b2-2cad3885a83b] Best, NSAC Council Follow us on: LinkedIn<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.linke…> Instagram<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.insta…> Email: NSAC(a)purdue.edu[Shape line art] Web: https://engineering.purdue.edu/NSAC/

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2024 Symposium on Reliability for Electronics and Photonics Packaging (program schedule pdf attached)
by Wei, Tiwei 07 Nov '24

07 Nov '24

Here is the zoom link for the symposium. Join Zoom Meeting https://purdue-edu.zoom.us/j/95751672483?pwd=NuLFDlze0idlcULCx5siCDy6uW99MY…<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue-ed…> Meeting ID: 957 5167 2483 Passcode: 345582 --- One tap mobile +13126266799,,95751672483#<tel:+13126266799,95751672483>,,,,*345582# US (Chicago) +16465588656,,95751672483#<tel:+16465588656,95751672483>,,,,*345582# US (New York) --- Dial by your location • +1 312 626 6799<tel:+13126266799> US (Chicago) • +1 646 558 8656<tel:+16465588656> US (New York) • +1 646 931 3860<tel:+16469313860> US • +1 301 715 8592<tel:+13017158592> US (Washington DC) • +1 305 224 1968<tel:+13052241968> US • +1 309 205 3325<tel:+13092053325> US • +1 564 217 2000<tel:+15642172000> US • +1 669 444 9171<tel:+16694449171> US • +1 669 900 6833<tel:+16699006833> US (San Jose) • +1 689 278 1000<tel:+16892781000> US • +1 719 359 4580<tel:+17193594580> US • +1 253 205 0468<tel:+12532050468> US • +1 253 215 8782<tel:+12532158782> US (Tacoma) • +1 346 248 7799<tel:+13462487799> US (Houston) • +1 360 209 5623<tel:+13602095623> US • +1 386 347 5053<tel:+13863475053> US • +1 507 473 4847<tel:+15074734847> US Meeting ID: 957 5167 2483 Passcode: 345582 Find your local number: https://purdue-edu.zoom.us/u/aeqITTNUAV<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue-ed…> --- Join by SIP • 95751672483(a)zoomcrc.com<mailto:95751672483@zoomcrc.com> --- Join by H.323 • 162.255.37.11 (US West) • 162.255.36.11 (US East) Meeting ID: 957 5167 2483 Passcode: 345582 Dear all, The final symposium program schedule is attached in this calendar invitation. Looking forward to seeing you all next week. The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001, in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability: (1) Reliability for Thermal, Mechanical, and Cooling Systems (2) Reliability for Analog/RF and Power Integrated Circuits (3) Reliability for Photonics (4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. We look forward to seeing you at REPP 2024! [cid:image001.png@01DB2CAB.47AA8970][cid:image002.png@01DB2CAB.47AA8970] [cid:image003.png@01DB2CAB.47AA8970][cid:image004.png@01DB2CAB.47AA8970]

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2024 Symposium on Reliability for Electronics and Photonics Packaging (program schedule pdf attached)
by Wei, Tiwei 01 Nov '24

01 Nov '24

Dear all, The final symposium program schedule is attached in this calendar invitation. Looking forward to seeing you all next week. The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001, in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability: (1) Reliability for Thermal, Mechanical, and Cooling Systems (2) Reliability for Analog/RF and Power Integrated Circuits (3) Reliability for Photonics (4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. We look forward to seeing you at REPP 2024! [cid:image001.png@01DB2CAB.47AA8970][cid:image002.png@01DB2CAB.47AA8970] [cid:image003.png@01DB2CAB.47AA8970] [cid:image004.png@01DB2CAB.47AA8970]

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