Forwarding on behalf of Shubhra Bansal: Lisa Stacey Lead Administrative Assistant School of Materials Engineering Neil Armstrong Hall of Engineering o: 765-494-4095 f: 765-494-1204 [3749DD84]<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Furldefense.proofpoint.com%2Fv2%2Furl%3Fu%3Dhttps-3A__www.purdue.edu_-3Futm-5Fsource-3Dsignature-26utm-5Fmedium-3Demail-26utm-5Fcampaign-3Dpurdue%26d%3DDwMFAg%26c%3Dl45AxH-kUV29SRQusp9vYR0n1GycN4_2jInuKy6zbqQ%26r%3DcYZgnbkB39R9SYPCvL_MkXuih1H-IjjKyRBtQtQ6ib8%26m%3DH5ec4nXIY6Mt-FgrmXhcB1ClcZZRWvtSm3BzPca31UE%26s%3Dra1N_tE4A3L7IxFqllrao41XR8k0ynZZYRxh3KMpTwY%26e%3D&data=05%7C02%7Cmsepostdoc-list%40ecn.purdue.edu%7C4817e78f9a97449b22e408de80674771%7C4130bd397c53419cb1e58758d6d63f21%7C1%7C0%7C639089378468378842%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=aJycr4IVN8c3uYeRX%2FVqhFwQ8sIN4HTYPWBY46XrvbI%3D&reserved=0> ________________________________ SCALE HI/AP Technical Vertical will be hosting Dr. Jaesik Lee from SK Hynix on Tuesday, March 24 for an industry lecture. This seminar is a part of ME597 "Fundamentals of Microsystems Packaging" course that I am offering in Spring 2026. Please circulate the attached flyer to undergraduate and graduate students, who may be interested in learning about Advanced Packaging for HBM. Seminar Speaker: Dr. Jaesik Lee, Vice President SK Hynix USA Title: The Role of Semiconductor Packaging in the AI Era Time and Location: Tuesday, March 24 @ 3:00 P.M. Mechanical Engineering ME-1012 and Zoom<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdueedu.zoom.us%2Fj%2F91592059777%3Fpwd%3Dnmm5W8lYIr6jlbq7OyEDPuhr4mPohZ.1&data=05%7C02%7Cmsepostdoc-list%40ecn.purdue.edu%7C4817e78f9a97449b22e408de80674771%7C4130bd397c53419cb1e58758d6d63f21%7C1%7C0%7C639089378468440653%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=7x196ssha3wvUQKH0nL8fqWwpdx87bO979OriRHPg5U%3D&reserved=0>. [cid:image002.png@01DCB22E.9C5A5E00]