Forwarding on behalf of Shubhra Bansal:

 

Lisa Stacey
Lead Administrative Assistant
School of Materials Engineering

Neil Armstrong Hall of Engineering
o: 765-494-4095   f: 765-494-1204

3749DD84

 

SCALE HI/AP Technical Vertical will be hosting Dr. Jaesik Lee from SK Hynix on Tuesday, March 24 for an industry lecture. This seminar is a part of ME597 “Fundamentals of Microsystems Packaging” course that I am offering in Spring 2026. Please circulate the attached flyer to undergraduate and graduate students, who may be interested in learning about Advanced Packaging for HBM.

 

Seminar Speaker: Dr. Jaesik Lee, Vice President SK Hynix USA

Title: The Role of Semiconductor Packaging in the AI Era

Time and Location: Tuesday, March 24 @ 3:00 P.M. Mechanical Engineering ME-1012 and Zoom.