Hi everyone, Attached is the application for those of you who would like to go on the implantation trip. Please note that you must pay dues to qualify. You may either fill out and email the application back to daya@purdue.edu<mailto:daya@purdue.edu> with "Papachacra Application" in the subject or fill out the online version here: http://spreadsheets.google.com/viewform?formkey=dDROSFg1bzBtVGdOenBXZkd6N1BH... The hard deadline for the application is Saturday, May 1st at 11:59 PM. Thanks, Alex ___________________________________________________________ Alexander Day President, Engineers Without Borders Undergraduate Student Aid, Global Engineering Program Purdue University Civil Engineering Building, Room 1259 daya@purdue.edu<mailto:daya@purdue.edu>