Hi everyone,
Attached is the application for those of you who would like
to go on the implantation trip. Please note that you must pay dues to qualify.
You may either fill out and email the application back to daya@purdue.edu
with “Papachacra Application” in the subject or fill out the online version
here:
http://spreadsheets.google.com/viewform?formkey=dDROSFg1bzBtVGdOenBXZkd6N1BHWUE6MQ
The hard deadline for the application is Saturday, May 1st
at 11:59 PM.
Thanks,
Alex
___________________________________________________________
Alexander
Day
President,
Engineers Without Borders
Undergraduate
Student Aid, Global Engineering Program
Purdue
University
Civil
Engineering Building, Room 1259