Please consider attending the following: MATERIALS ENGINEERING SEMINAR "The Magnetic Alignment of Hexagonal Boron Nitride and Liquid-crystalline Polymer for Thermal Management Applications" By John Bui Purdue MSE Ph.D. Preliminary Exam Advisor: Professor Mukerrem Cakmak ABSTRACT There is a current trend in consumer electronics toward devices with slimmer profiles which contain components with higher processing power; as such, the generation of heat and the efficient transfer of that heat to the external environment has become more critical in maintaining optimal device performance as well as extending service lifetime. In this paper, a rationale for material selection and processing with respect to polymeric composites will be proposed to address this issue by fabricating an anisotropic film for use as a thermal interface material or TIM. For this case, an electromagnet will be used to align both the matrix and filler phase, respectively as follows: a thermotropic liquid crystalline polymer and surface-modified hexagonal boron nitride. Date: Monday, February 25, 2019 Time: 2:00 P.M. Place: ARMS 1028