From: Leslie Faiers <leslie.faiers@src.org> Sent: Monday, June 10, 2019 6:55 PM To: Yong Chen <yongchen@purdue.edu> Subject: SRC opens FIVE Solicitations: Computer-Aided Design and Test, Logic and Memory Devices, AI Hardware, Packaging, and Packaging (CHIRP) Semiconductor Research Corporation (SRC) is soliciting white papers in the areas of Computer-Aided Design and Test (CADT), Logic and Memory Devices (LMD), AI Hardware (AIHW), Packaging (PKG) and Packaging "CHIRP" (PKG CHIRP). Please note white papers addressing the needs in the corresponding Research Needs documents are to be uploaded by the deadline noted in each solicitation timeline. Each researcher may be involved in no more than two submissions per call. A selected white paper will result in an invitation to submit a full proposal for further consideration for a research contract. The white paper solicitations, needs documents, and instructions for submissions can be found at: * Computer-Aided Design and Test<https://www.src.org/funding-opportunities/Pages/CADT-2019-Solicitation.aspx> * Logic and Memory Devices<https://www.src.org/funding-opportunities/Pages/2019-LMD-Solicitation.aspx> * AI Hardware<https://www.src.org/funding-opportunities/Pages/2019-AI-Hardware-Solicitation.aspx> * Packaging<https://www.src.org/funding-opportunities/Pages/Packaging-2019-Solicitation.aspx> * Packaging (CHIRP)<https://www.src.org/funding-opportunities/Pages/CHIRP-2019-Solicitation.aspx> Kind regards, Leslie Leslie Faiers Research Operations Semiconductor Research Corp. 4819 Emperor Blvd., Suite 300 Durham, NC 27703 Office: +1 919.941.9455 Cell: +1 919.656.4419 E-mail: leslie.faiers@src.org<mailto:leslie.faiers@src.org> SRC respects your personal data. For information see our Privacy Policy<https://www.src.org/privacy>.