Dear Colleagues, You received an email from Dana Weinstein on March 13 about Scifres’ new rates effective this summer (see below). The paperwork for new rates was sent for approval signatures more than six months ago and was signed off for implementation effective July 1st of this year. Recently, Cost Accounting notified us that they had overlooked and some rates need to be adjusted. I've attached the analysis sheet to this email. We took Dana's original chart and added columns to show the Updated User Charge and the New % Increase. The color coding indicates lower, higher, or the same new rates as compared to the previous proposal. For example, the proposed new rate for the LPKF Milling system ($70) is the same as the proposed previous rate, both a 5% reuction from the original rate of $74. Since both proposed rates were the same the % Increase column shows the consistent 5% reduction in price but is colored gray to indicate no change in proposed rates. On the other hand the ASE etcher was originally proposed to maintain its previous rate of $48 but now it is reduced to $37 so it was colored green to indicate a new lower rate. In the final analysis we reduced rates on 25 tools (coded green), and to balance the subsidy we increased rates on 18 tools (coded blue). The remaining 58 tools (coded gray) had no change in proposed rates. This modified set of rates is in the final stages of signature approval and will be implemented effective July 1st, as before. Since our overall subsidy is similar, I don’t anticipate big impact on your research grants. However, don’t hesitate if there are any issues or if you have any questions or comments. Best regards, Ali Ali Shakouri Mary Jo and Robert L. Kirk Director Professor of Electrical and Computer Engineering Birck Nanotechnology Center, Room 1027 Purdue University 1205 West State Street West Lafayette, IN 47907-2057 (765) 496-6105; Fax: (765) 496-8299 shakouri@purdue.edu<mailto:shakouri@purdue.edu> -----Original Message----- From: Weinstein, Dana <danaw@purdue.edu<mailto:danaw@purdue.edu>> Sent: Wednesday, March 13, 2019 4:31 PM To: Weinstein, Dana <danaw@purdue.edu<mailto:danaw@purdue.edu>> Cc: Shakouri, Ali <shakouri@purdue.edu<mailto:shakouri@purdue.edu>>; Cox, Erica L <ericacox@purdue.edu<mailto:ericacox@purdue.edu>>; Reger, Ronald K <rreger@purdue.edu<mailto:rreger@purdue.edu>>; Chen, Yong P <chen276@purdue.edu<mailto:chen276@purdue.edu>> Subject: BNC recharge rates adjustment Dear Birck PIs, We recently performed an evaluation of recharge rates for Scifres (the Birck cleanroom), and will be rolling out the new rates on July 1. In order to assist with planning your budgets, we want to alert you to the modification in Scifres costs in advance of the roll-out. This task should be performed at least every two years. However, this is the first such evaluation since 2012 and, as such, may come as a surprise to some PIs. Break-even rates for each tool are first calculated based on engineer time dedicated to the tool, cost of supplies, and usage. The final tool rate is then proposed based on these values, while ensuring that the facility does not make a profit. The average increase across the 104 tools/services in Scifres is 12%. The new rate is just 2.4% above the inflation rate from 2012. In all, 17 tools have seen a decrease in rate, while only a handful have increased substantially (e.g. CMP, CPD, Hall Effect system, a couple furnaces) due to dramatic change in usage or increased cost of maintenance due to aging. These rates are competitive with those of our peer facilities across the country. The proposed rates are attached for your reference. In addition to these tools, we have various new capabilities recently available or coming up in the next few months (and in some cases weeks), which will add substantial capabilities to all users. Most new tools already have rates determined, while the most recent will be calculated and made available to users as they come. o Heidelberg MLA150 direct write lithography w/back side alignment, gray scale, high throughput (up and running) o Automatic developer/mask etcher/spin rinse for wafers, pieces, and reticles o FEI Apreo Cleanroom SEM o AJA ion mill with end point detection (finally up and running) o Plasma-Therm HDPCVD deposition tool with low temp high density film capability o RCA clean hood in furnace area (up and running) o Keyence digital microscope w/large depth of field and tilt capabilities (up and running) o 2 RIE etchers for O2, Ar, CF4 (replacing the old Plasmatec, up and running) o IKO Jr. electroplating system w/2 interchangeable baths o Vacuum oven o Magnetic sputtering system Finally, PIs should be aware of a modification to the Scifres cap model. The new cap policy is a bit more democratic and is aimed to encourage heavier user of the cleanroom by those who just miss the previous hard cap of 13k/yr. The new model is as follows: Modified cap model: A single user who accumulates expenses in excess of $10,000 but not more than $13,000 will have a soft cap applied (users pay 20% of normal rate). A single user who has expenses in excess of $13,000 will have a hard cap (no charge). Any user whose expenses exceed $28,000 will revert back to paying 100% of their charges. In each of these scenarios, the charges incurred have to be for the same user on the same project and excludes the JEOL E-Beam Writer, staff time and expenses for precious metals and supplies. The exclusion of the JEOL ebeam lithography system from the cap reflects its disproportionate subsidy (due to the necessary service contract) and follows policy similar to that of comparable university fabs. ——————————————— Dana Weinstein Associate Professor, Electrical and Computer Engineering Associate Director of Operations, Birck Nanotechnology Center, Discovery Park Purdue University https://engineering.purdue.edu/hybridmems