FYI ---------- Forwarded message ---------- From: Aaron Mazzeo <aaron.mazzeo@rutgers.edu> Date: Tue, Jul 17, 2018 at 9:55 PM Subject: ASME IMECE: Material Processing of Flexible Electronics, Sensors, and Devices To: Babak Ziaie <bziaie@purdue.edu> Babak, We are organizing a topic for ASME IMECE on the "Material Processing of Flexible Electronics, Sensors, and Devices". The deadline to submit abstracts for presentations is Monday, July 23rd, and the conference will take place from November 12th to 15th in Pittsburgh, PA. Please consider submitting your own abstract or passing this message along to those who might have an interest in participating. This topic/symposium will cover experimental, design-related, and mechanics-based efforts toward manufacturing or fabricating flexible electronics, sensors, and devices. Sessions might include but are not limited to materials research or processing techniques related to the following areas: • Modified conventional semiconductor-based processing for large-scale flexible devices • Materials for biological/human-based monitoring of performance or other factors • Contact printing/soft lithography and printed electronics • Additive manufacturing of 3D architected electronics • Design/fabrication of elastomeric actuators • Electroactive polymers • Transparent electronics • Novel stretchable or flexible substrates • Energy harvesting • Wearable devices • Skin-like sensors To see this topic on the ASME 2018 IMECE website, you may follow this link <http://www.asmeconferences.org/IMECE2018/TechnicalTracks.cfm>, click on Materials: Genetics to Structures, and then click on Topic 11-8 Material Processing of Flexible Electronics, Sensors, and Devices. To submit an abstract, you may follow this link <http://www.asmeconferences.org/IMECE2018/Author/NewAbstract.cfm>. We hope to replicate and build on successes at IMECE 2014-2017 with multiple sessions, productive discussions, and interactions. We are grateful for the sponsorship of the Materials Processing Technical Committee of the Materials Division, the Electronic Materials Technical Committee of the Materials Division, and the Materials Processing and Manufacturing Technical Committee of the Applied Mechanics Division. If you have any questions, please feel free to contact me by phone (1-848-228-2498) or email <aaron.mazzeo@rutgers.edu> <aaron.mazzeo@rutgers.edu>. You may also contact the co-organizers listed below. Thank you for your time and consideration. Aaron Aaron Mazzeo (aaron.mazzeo@rutgers.edu), Department of Mechanical and Aerospace Engineering, Rutgers University Qiming Wang (qimingw@usc.edu), Department of Civil and Environmental Engineering, University of Southern California Jianliang Xiao (Jianliang.Xiao@colorado.edu), Department of Mechanical Engineering, University of Colorado W. Hong Yeo (whyeo@gatech.edu), Woodruff School of Mechanical Engineering, Georgia Institute of Technology Cunjiang Yu (cyu13@central.uh.edu), Department of Mechanical Engineering, University of Houston Yuris Dzenis (ydzenis@unl.edu), Department of Mechanical and Materials Engineering, University of Nebraska at Lincoln
