BNC Faculty Member –
We currently have an unused chemical-mechanical polishing system in BRK 2031. This is a specialized system purchased by Steve Beaudoin for the removal of copper from substrates, and has no thickness controls, etc. It can be used as a manual system only. Steve no longer has a need for this system.
The cost to bring this system into operation for manual wafer thinning, etc., is between $30k and $40k. Currently there has been no interest by any faculty members to use this system. Under these circumstances, it is recommended that the system be moved out of the laboratory and the space made available for other equipment.
If you have an interest in this system and the funding to bring it into operation, please let me know right away. If not, we will proceed with the removal of this system.
Thank you for your assistance in this matter,
John
John R. Weaver Facility Manager Birck Nanotechnology Center Purdue University (765) 494-5494 jrweaver@purdue.edu