Beginning Wednesday, 7 August 2013 (tomorrow), work will begin on saw-cutting the subfab floor for the new trench drain. This activity will continue through the end of the day Thursday, 8 August 2013. This activity will generate significant acoustical noise, especially in the high frequencies. There also may be some vibration associated with the cutting. Please take this into account when planning your activities. Work will be performed during the 7:00 am - 4:00 pm time frame. Thank you for your understanding during this initial phase of the lab expansion projects. John Weaver John R. Weaver Facility Manager Birck Nanotechnology Center 1205 West State Street West Lafayette IN 47907 (765) 494-5494 jrweaver@purdue.edu<mailto:jrweaver@purdue.edu> nano.purdue.edu