MATERIALS SCIENCE AND ENGINEERING
Effect of Crystallographic Orientation on Sub-critical
Grain Boundary Cracking in a Nickel Based Superalloy
by
Kameshwaran Swaminathan
Master of Science Final Examination
Co-Advisors:
Prof. J. Blendell and Prof. K. Trumble
ABSTRACT
Sub-critical intergranular crack growth is an important creep fracture mechanism in polycrystalline superalloys. The root cause of this fracture is not well understood. The role of grain orientation on the formation
of sub-critical grain boundary cracks during creep of a conventionally cast nickel-based superalloy has been analyzed in this study. The crystallographic orientations of grain pairs adjacent to grain boundaries normal to the tensile axis were measured using
Electron Back-Scattered Diffraction (EBSD). The difference in the Schmid factor for the {111} <112> slip system between the grains was compared to the occurrence of sub-critical grain boundary cracking. In addition, the difference in the amount of potential
primary creep strain between the grains (for unconstrained state) was analyzed. The cracked grain boundaries were found to have significantly larger Schmid factor mismatch, as well as larger potential primary creep strain mismatch, than those of the uncracked
grain boundaries. These larger mismatches in Schmid factor and potential primary creep strain indicate possible development of large enough stress concentration at the grain boundary sufficient to initiate sub-critical cracks. The experimental results suggest
possible correlation between crystallographic orientation of the grains and sub-critical cracking at the grain boundary with a critical value for Schmid factor mismatch and potential primary creep strain mismatch in the creep tested alloy. Assumptions and
limitations are considered in proposing future experiments for further refinement of the analysis.
Date: Thursday, November 8, 2012
Time: 8:30 A.M.
Place: ARMS 1028
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PURDUE MSE
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Lisa Stacey
Secretary/Development Assistant
Purdue University
School of Materials Engineering
765/494-4100