BEGIN:VCALENDAR METHOD:REQUEST PRODID:Microsoft Exchange Server 2010 VERSION:2.0 BEGIN:VTIMEZONE TZID:US Eastern Standard Time BEGIN:STANDARD DTSTART:16010101T020000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;INTERVAL=1;BYDAY=1SU;BYMONTH=11 END:STANDARD BEGIN:DAYLIGHT DTSTART:16010101T020000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;INTERVAL=1;BYDAY=2SU;BYMONTH=3 END:DAYLIGHT END:VTIMEZONE BEGIN:VEVENT ORGANIZER;CN="Wei, Tiwei":mailto:wei427@purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=BRK_1001: mailto:BRK_1001@purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=s-packall @lists.purdue.edu:mailto:s-packall@lists.purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=S-PACK Gr aduate Announcments:mailto:s-packgrad@lists.purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=semicondu ctor_team@ecn.purdue.edu:mailto:semiconductor_team@ecn.purdue.edu 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JOO:mailto:ranjan.rajoo@globalfoundries.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Abhijit D asgupta:mailto:dasgupta@umd.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN='Gnyanesh war Ramakrishna ' (gnramakr):mailto:gnramakr@cisco.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Luu Nguye n:mailto:lnguyen@psiquantum.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Gromala P rzemyslaw Jakub (AE/ECH-PL1):mailto:PrzemyslawJakub.Gromala@de.bosch.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=p.wesling @ieee.org:mailto:p.wesling@ieee.org ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Shiguo Ra o:mailto:richard.rao@ieee.org ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Farnood R ezaie (frezaie):mailto:frezaie@cisco.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=hualiang. shi@gmail.com:mailto:hualiang.shi@gmail.com 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racraft@gmail.com:mailto:michael.cracraft@gmail.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Lyu, Shuh ang":mailto:lyu129@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=cracraft@ rose-hulman.edu:mailto:cracraft@rose-hulman.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Manohar B ongarala (Nokia):mailto:manohar.bongarala@nokia-bell-labs.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Nagrani, Pranay Praveen":mailto:pnagrani@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Gabe Vela rde:mailto:gvelarde@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Holaday, John Ryan":mailto:jholaday@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Samuel Ja mes Sheeder:mailto:ssheeder@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=ie-comput es@lists.purdue.edu:mailto:ie-computes@lists.purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Research communications for Digital Twin in Industrial Operations:mailto:DigiT-IO@l ists.purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Bnc-grads -list@ecn.purdue.edu:mailto:Bnc-grads-list@ecn.purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Ethan Fre derick Walker:mailto:efwalker@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Malshe, A jay P":mailto:amalshe@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=mcclupa@u md.edu:mailto:mcclupa@umd.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Marconnet , Amy M":mailto:amarconn@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Amr Hagga g:mailto:Amr.Haggag@arm.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=sreekant. narumanchi@nrel.gov:mailto:Sreekant.Narumanchi@nrel.gov ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Srikanth Rangarajan:mailto:srangar@binghamton.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Luca Amal fi:mailto:luca.amalfi@seguente.tech ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Ryan Enri ght:mailto:ryan.enright@seguente.tech ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=alexander .hillstrom@scania.com:mailto:alexander.hillstrom@scania.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Alexander Grill (imec):mailto:Alexander.Grill@imec.be ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Katherine Jiang:mailto:kaiying@stanford.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=luigi.bal estra5@unibo.it:mailto:luigi.balestra5@unibo.it ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=reza.ghaf farian@jpl.nasa.gov:mailto:reza.ghaffarian@jpl.nasa.gov ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=gmatres@g dsfactory.com:mailto:gmatres@gdsfactory.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Kulkarni, Ritwik Vijaykumar":mailto:kulka103@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Yan Li:ma ilto:yan.a.li@samsung.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Bansal, S hubhra":mailto:bansal91@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=bhattass@ ime.a-star.edu.sg:mailto:bhattass@ime.a-star.edu.sg ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=yifanyao3 -c@my.cityu.edu.hk:mailto:yifanyao3-c@my.cityu.edu.hk ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=David Coe nen (imec):mailto:David.Coenen@imec.be ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Ganesh Su bbarayan:mailto:ganeshs@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=jason.zha ng@intel.com:mailto:jason.zhang@intel.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Oguzhan O rkut Okudur (imec):mailto:Oguzhan.Orkut.Okudur@imec.be ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=wpk@illin ois.edu:mailto:wpk@illinois.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Mario Gon zalez (imec):mailto:Mario.Gonzalez@imec.be ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=dhuitin@u ark.edu:mailto:dhuitin@uark.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Harsányi Gábor:mailto:harsanyi.gabor@vik.bme.hu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=michael.b lattau@ansys.com:mailto:michael.blattau@ansys.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=CoE Dean Scheduling:mailto:CoEDeanScheduling@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Ganju, Es han":mailto:eganju@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Sidhaant Vasudeva:mailto:vasude13@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Deolia, A kshay":mailto:adeolia@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Anderson, Niklas Eric":mailto:ande1290@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Mehdi Ash eghi:mailto:masheghi@stanford.edu ATTACH:CID:070B7911AEBF374589F51D97C10F9ECF@namprd22.prod.outlook.com ATTACH:CID:E1016475037BE340A1F74005BB14F147@namprd22.prod.outlook.com ATTACH:CID:image001.png@01DB2CAB.47AA8970 ATTACH:CID:image002.png@01DB2CAB.47AA8970 ATTACH:CID:image003.png@01DB2CAB.47AA8970 ATTACH:CID:image004.png@01DB2CAB.47AA8970 DESCRIPTION;LANGUAGE=en-US:Dear all\,\n\nThe final symposium program schedu le is attached in this calendar invitation. Looking forward to seeing you all next week.\n\nThe 2024 Symposium on Reliability for Electronics and Ph otonics Packaging (REPP) will take place on November 7-8\, 2024\, at Purdu e University\, BRK 1001\, in West Lafayette\, Indiana\, USA. This year's symposium will feature four special sessions focused on reliability:\n(1) Reliability for Thermal\, Mechanical\, and Cooling Systems\n(2) Reliabilit y for Analog/RF and Power Integrated Circuits\n(3) Reliability for Photoni cs\n(4) Reliability and Metrology for Advanced Packaging and 3D Interconne cts in AI and HPC\nIEEE REPP-2024 will be a hybrid event\, offering both i n-person and virtual participation via WebEx. For more details\, please vi sit our REPP website: https://lnkd.in/gj3DTigA. To register\, use the following link: https://lnkd.in/gS8u6PtU. We look forward to seeing you at REPP 2024 !\n\n[cid:image001.png@01DB2CAB.47AA8970][cid:image002.png@01DB2CAB.47AA89 70]\n\n\n[cid:image003.png@01DB2CAB.47AA8970] [cid:image004.png@01DB2CAB.4 7AA8970]\n\n UID:A6F27A48-982C-4749-B845-C83BD09DD8DB SUMMARY;LANGUAGE=en-US:2024 Symposium on Reliability for Electronics and Ph otonics Packaging (program schedule pdf attached) DTSTART;TZID=US Eastern Standard Time:20241107T080000 DTEND;TZID=US Eastern Standard Time:20241108T180000 CLASS:PUBLIC PRIORITY:5 DTSTAMP:20241102T021337Z TRANSP:OPAQUE STATUS:CONFIRMED SEQUENCE:43 LOCATION;LANGUAGE=en-US:BRK_1001 X-MICROSOFT-CDO-APPT-SEQUENCE:43 X-MICROSOFT-CDO-OWNERAPPTID:2123002697 X-MICROSOFT-CDO-BUSYSTATUS:TENTATIVE X-MICROSOFT-CDO-INTENDEDSTATUS:BUSY X-MICROSOFT-CDO-ALLDAYEVENT:FALSE X-MICROSOFT-CDO-IMPORTANCE:1 X-MICROSOFT-CDO-INSTTYPE:0 X-MICROSOFT-DONOTFORWARDMEETING:FALSE X-MICROSOFT-DISALLOW-COUNTER:FALSE X-MICROSOFT-REQUESTEDATTENDANCEMODE:DEFAULT X-MICROSOFT-ISRESPONSEREQUESTED:FALSE X-MICROSOFT-LOCATIONDISPLAYNAME:BRK_1001 X-MICROSOFT-LOCATIONSOURCE:Resource X-MICROSOFT-LOCATIONURI:BRK_1001@purdue.edu X-MICROSOFT-LATITUDE:0 X-MICROSOFT-LONGITUDE:0 X-MICROSOFT-LOCATIONS:[{"DisplayName":"BRK_1001"\,"LocationAnnotation":""\, "LocationSource":5\,"LocationUri":"BRK_1001@purdue.edu"\,"Latitude":0.0\," Longitude":0.0\,"LocationStreet":""\,"LocationCity":""\,"LocationState":"" \,"LocationCountry":""\,"LocationPostalCode":""\,"LocationFullAddress":""} ] END:VEVENT END:VCALENDAR