The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001, in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability: (1) Reliability for Thermal, Mechanical, and Cooling Systems (2) Reliability for Analog/RF and Power Integrated Circuits (3) Reliability for Photonics (4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2Fgj3DTigA&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7C43d622983b084b216d9908dcecc1e1a2%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638645564706090891%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=InyYcQ4iN8pHnp55JFEkNs7urXe8QgDbxcv%2B5DZr%2BVg%3D&reserved=0>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2FgS8u6PtU&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7C43d622983b084b216d9908dcecc1e1a2%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638645564706090891%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=uhYgSbCW2epzioF5Wn5seLN1vZH3EgduG90SEeqK9DY%3D&reserved=0>. We look forward to seeing you at REPP 2024! [No alt text provided for this image][No alt text provided for this image] [No alt text provided for this image][No alt text provided for this image]