Hello All - Please be advised of Dr. Dongkai Shangguan's guest lecture hosted by our IEEE- Electronic Packaging Society - Central Indiana chapter. The lecture is on "Interconnect Reliability in Advanced Packaging and Heterogeneous Integration". It is hosted at Birck 1001 on August 31st from noon- 1:00 pm and snacks will be served at 11:30 am. [cid:2523cb00-edef-4489-acac-d637666bbb1c] Manohar Bongarala PhD Candidate, Cooling Technologies Research Center Secretary, IEEE Electronic Packaging Society - Central Indiana Section School of Mechanical Engineering, 585 Purdue Mall, IN LinkedIn<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.linkedin.com%2Fin%2Fhttps%3A%2F%2Fwww.linkedin.com%2Fin%2Fmanohar-bongarala%2F&data=05%7C01%7Cbnc-all%40ecn.purdue.edu%7C75d73bfcb4474361942d08dba299b51e%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638282553634286130%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=JQZl%2BE1cJyzOUbLRaKfX4uWEa8Y9puFX1PSNtg2PBIs%3D&reserved=0>; https://r4.ieee.org/cis-eps/<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fr4.ieee.org%2Fcis-eps%2F&data=05%7C01%7Cbnc-all%40ecn.purdue.edu%7C75d73bfcb4474361942d08dba299b51e%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638282553634286130%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=8%2BsDsYkjXFHOStphEQGpDO0sbJ9sY0Z9KuRfn6mde90%3D&reserved=0> [Purdue University]<https://www.purdue.edu/?utm_source=signature&utm_medium=email&utm_campaign=purdue>
