Dear Birck Community, You are cordially invited to attend the PhD Preliminary Exam of Shuhang Lyu from the School of Mechanical Engineering. His research focuses on: “Understanding Thermomechanical Response of Scaled Through-Silicon Vias for High-Density
3D Packaging.” We hope you can join us in supporting Shuhang for this important milestone. Location: Birck 1001, Time: Monday, April 21, 2025 from 09:15 to 11:00 am Best regards, Tiwei & Thomas
Sent from my phone.
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Tiwei Wei
Assistant Professor
School of Mechanical Engineering
Birck Nanotechnology Center
Purdue University, 1205 W State St, West Lafayette, IN 47907
Office: Birck 2044, Phone: 650-505-6084, Email: tiwei@purdue.edu
https://engineering.purdue.edu/ME/People/ptProfile?resource_id=268748
Research Group: S-PACK Lab https://s-pack.org/
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