I am Vardhan Vydyula, a graduate student in Mechanical Engineering and secretary of the IEEE Electronics Packaging Society, Central Indiana. The IEEE Electronic Packaging Society is hosting a seminar talk by Dr Abhijit Dasgupta, Jeong H. Kim Professor of Mechanical Engineering at the University of Maryland, on the topic "Reliability Modeling Approaches: Physics or AI/ML?" on Friday, May 1st, from 11:00 AM to noon in ARMS 3115. Can you please help publicize the event among the Birck professors, grad students, postdocs, and staff? I am attaching the flyer to this email. The link to registration is: https://r4.ieee.org/cis-eps/<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fr4.ieee.org%2Fcis-eps%2F&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7Ccd1a27d10631454856ed08de9ee923aa%7C4130bd397c53419cb1e58758d6d63f21%7C1%7C0%7C639122921317610985%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=qz4FbELmnOLJ0r%2BIn%2BqK4Qd%2FnhhaM3a9wdm6BANJuD4%3D&reserved=0> Thank you for your help! Best regards, Vardhan Vydyula Graduate Research Assistant Cooling Technologies Research Center School of Mechanical Engineering Purdue University, West Lafayette, IN. Secretary, IEEE EPS Central Indiana Chapter