BEGIN:VCALENDAR METHOD:REQUEST PRODID:Microsoft Exchange Server 2010 VERSION:2.0 BEGIN:VTIMEZONE TZID:US Eastern Standard Time BEGIN:STANDARD DTSTART:16010101T020000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;INTERVAL=1;BYDAY=1SU;BYMONTH=11 END:STANDARD BEGIN:DAYLIGHT DTSTART:16010101T020000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;INTERVAL=1;BYDAY=2SU;BYMONTH=3 END:DAYLIGHT END:VTIMEZONE BEGIN:VEVENT ORGANIZER;CN="Wei, Tiwei":mailto:wei427@purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=BRK_1001: mailto:BRK_1001@purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=s-packall @lists.purdue.edu:mailto:s-packall@lists.purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=S-PACK Gr aduate Announcments:mailto:s-packgrad@lists.purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=semicondu ctor_team@ecn.purdue.edu:mailto:semiconductor_team@ecn.purdue.edu ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=bnc-all@e cn.purdue.edu:mailto:bnc-all@ecn.purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Richard R ao:mailto:richardrao@marvell.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Sanketh B uggaveeti:mailto:SBuggaveeti@infinera.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Kristof C roes (imec):mailto:Kristof.Croes@imec.be ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Smet, Van essa":mailto:vanessa.smet@me.gatech.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Willem va n Driel:mailto:willem.van.driel@signify.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=RANJAN RA JOO:mailto:ranjan.rajoo@globalfoundries.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Abhijit D asgupta:mailto:dasgupta@umd.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN='Gnyanesh war Ramakrishna ' (gnramakr):mailto:gnramakr@cisco.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Luu Nguye n:mailto:lnguyen@psiquantum.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Gromala P rzemyslaw Jakub (AE/ECH-PL1):mailto:PrzemyslawJakub.Gromala@de.bosch.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=p.wesling @ieee.org:mailto:p.wesling@ieee.org ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Shiguo Ra o:mailto:richard.rao@ieee.org ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Farnood R ezaie (frezaie):mailto:frezaie@cisco.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=hualiang. shi@gmail.com:mailto:hualiang.shi@gmail.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Soumya.00 5@gmail.com:mailto:soumya.005@gmail.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Tiwei Wei :mailto:tiwei@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=farnood@i eee.org:mailto:farnood@ieee.org ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=paul@pwes ling.com:mailto:paul@pwesling.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Parimala Vardhan Vydyula:mailto:pvydyula@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Mohammad, Tarek":mailto:mohammat@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=27jennyen ny@gmail.com:mailto:27jennyenny@gmail.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Kai-Chieh Chiang:mailto:chiang91@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Bongarala , Manohar":mailto:mbongara@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=michael.c racraft@gmail.com:mailto:michael.cracraft@gmail.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Lyu, Shuh ang":mailto:lyu129@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=cracraft@ rose-hulman.edu:mailto:cracraft@rose-hulman.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Manohar B ongarala (Nokia):mailto:manohar.bongarala@nokia-bell-labs.com ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Nagrani, Pranay Praveen":mailto:pnagrani@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Gabe Vela rde:mailto:gvelarde@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Holaday, John Ryan":mailto:jholaday@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Samuel Ja mes Sheeder:mailto:ssheeder@purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=ie-comput es@lists.purdue.edu:mailto:ie-computes@lists.purdue.edu ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Research communications for Digital Twin in Industrial Operations:mailto:DigiT-IO@l ists.purdue.edu ATTACH:CID:image001.jpg@01DB1E88.53F21080 ATTACH:CID:image002.jpg@01DB1E88.53F21080 ATTACH:CID:image003.jpg@01DB1E88.53F21080 ATTACH:CID:image004.jpg@01DB1E88.53F21080 DESCRIPTION;LANGUAGE=en-US:The 2024 Symposium on Reliability for Electronic s and Photonics Packaging (REPP) will take place on November 7-8\, 2024\, at Purdue University\, BRK 1001\, in West Lafayette\, Indiana\, USA. This year's symposium will feature four special sessions focused on reliabilit y:\n(1) Reliability for Thermal\, Mechanical\, and Cooling Systems\n(2) Re liability for Analog/RF and Power Integrated Circuits\n(3) Reliability for Photonics\n(4) Reliability and Metrology for Advanced Packaging and 3D In terconnects in AI and HPC\nIEEE REPP-2024 will be a hybrid event\, offerin g both in-person and virtual participation via WebEx. For more details\, p lease visit our REPP website: https://lnkd.in/gj3DTigA. To register\, use the following link: https://lnkd.in/gS8u6PtU. We look forward to seeing you at REPP 2024!\ n\n[No alt text provided for this image][No alt text provided for this ima ge]\n\n[No alt text provided for this image][No alt text provided for this image]\n\n\n UID:A6F27A48-982C-4749-B845-C83BD09DD8DB SUMMARY;LANGUAGE=en-US:2024 Symposium on Reliability for Electronics and Ph otonics Packaging (placeholder) DTSTART;TZID=US Eastern Standard Time:20241107T080000 DTEND;TZID=US Eastern Standard Time:20241108T180000 CLASS:PUBLIC PRIORITY:5 DTSTAMP:20241015T144247Z TRANSP:OPAQUE STATUS:CONFIRMED SEQUENCE:40 LOCATION;LANGUAGE=en-US:BRK 2001 X-MICROSOFT-CDO-APPT-SEQUENCE:40 X-MICROSOFT-CDO-OWNERAPPTID:2123002697 X-MICROSOFT-CDO-BUSYSTATUS:TENTATIVE X-MICROSOFT-CDO-INTENDEDSTATUS:BUSY X-MICROSOFT-CDO-ALLDAYEVENT:FALSE X-MICROSOFT-CDO-IMPORTANCE:1 X-MICROSOFT-CDO-INSTTYPE:0 X-MICROSOFT-DONOTFORWARDMEETING:FALSE X-MICROSOFT-DISALLOW-COUNTER:FALSE X-MICROSOFT-REQUESTEDATTENDANCEMODE:DEFAULT X-MICROSOFT-ISRESPONSEREQUESTED:FALSE X-MICROSOFT-LOCATIONDISPLAYNAME:BRK 2001 X-MICROSOFT-LOCATIONSOURCE:None X-MICROSOFT-LOCATIONS:[{"DisplayName":"BRK 2001"\,"LocationAnnotation":""\, "LocationUri":""\,"LocationStreet":""\,"LocationCity":""\,"LocationState": ""\,"LocationCountry":""\,"LocationPostalCode":""\,"LocationFullAddress":" "}] END:VEVENT END:VCALENDAR