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BEGIN:VEVENT
ORGANIZER;CN="Wei, Tiwei":mailto:wei427@purdue.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=BRK_1001:
 mailto:BRK_1001@purdue.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=s-packall
 @lists.purdue.edu:mailto:s-packall@lists.purdue.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=S-PACK Gr
 aduate Announcments:mailto:s-packgrad@lists.purdue.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=semicondu
 ctor_team@ecn.purdue.edu:mailto:semiconductor_team@ecn.purdue.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=bnc-all@e
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ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Richard R
 ao:mailto:richardrao@marvell.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Sanketh B
 uggaveeti:mailto:SBuggaveeti@infinera.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Kristof C
 roes (imec):mailto:Kristof.Croes@imec.be
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Smet, Van
 essa":mailto:vanessa.smet@me.gatech.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Willem va
 n Driel:mailto:willem.van.driel@signify.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=RANJAN RA
 JOO:mailto:ranjan.rajoo@globalfoundries.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Abhijit D
 asgupta:mailto:dasgupta@umd.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN='Gnyanesh
 war Ramakrishna ' (gnramakr):mailto:gnramakr@cisco.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Luu Nguye
 n:mailto:lnguyen@psiquantum.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Gromala P
 rzemyslaw Jakub (AE/ECH-PL1):mailto:PrzemyslawJakub.Gromala@de.bosch.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=p.wesling
 @ieee.org:mailto:p.wesling@ieee.org
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Shiguo Ra
 o:mailto:richard.rao@ieee.org
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Farnood R
 ezaie (frezaie):mailto:frezaie@cisco.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=hualiang.
 shi@gmail.com:mailto:hualiang.shi@gmail.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Soumya.00
 5@gmail.com:mailto:soumya.005@gmail.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Tiwei Wei
 :mailto:tiwei@purdue.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=farnood@i
 eee.org:mailto:farnood@ieee.org
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=paul@pwes
 ling.com:mailto:paul@pwesling.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Parimala 
 Vardhan Vydyula:mailto:pvydyula@purdue.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Mohammad,
  Tarek":mailto:mohammat@purdue.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=27jennyen
 ny@gmail.com:mailto:27jennyenny@gmail.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Kai-Chieh
  Chiang:mailto:chiang91@purdue.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Bongarala
 , Manohar":mailto:mbongara@purdue.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=michael.c
 racraft@gmail.com:mailto:michael.cracraft@gmail.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Lyu, Shuh
 ang":mailto:lyu129@purdue.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=cracraft@
 rose-hulman.edu:mailto:cracraft@rose-hulman.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN=Manohar B
 ongarala (Nokia):mailto:manohar.bongarala@nokia-bell-labs.com
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=FALSE;CN="Nagrani, 
 Pranay Praveen":mailto:pnagrani@purdue.edu
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DESCRIPTION;LANGUAGE=en-US:The 2024 Symposium on Reliability for Electronic
 s and Photonics Packaging (REPP) will take place on November 7-8\, 2024\, 
 at Purdue University\, BRK 1001\,  in West Lafayette\, Indiana\, USA. This
  year's symposium will feature four special sessions focused on reliabilit
 y:\n(1) Reliability for Thermal\, Mechanical\, and Cooling Systems\n(2) Re
 liability for Analog/RF and Power Integrated Circuits\n(3) Reliability for
  Photonics\n(4) Reliability and Metrology for Advanced Packaging and 3D In
 terconnects in AI and HPC\nIEEE REPP-2024 will be a hybrid event\, offerin
 g both in-person and virtual participation via WebEx. For more details\, p
 lease visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safel
 inks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2Fgj3DTigA&data=05%
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 rved=0>. To register\, use the following link: https://lnkd.in/gS8u6PtU<ht
 tps://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2F
 gS8u6PtU&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7C43d622983b084b216d9908d
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 qK9DY%3D&reserved=0>. We look forward to seeing you at REPP 2024!\n\n[No a
 lt text provided for this image][No alt text provided for this image]\n\n[
 No alt text provided for this image][No alt text provided for this image]\
 n\n\n
UID:A6F27A48-982C-4749-B845-C83BD09DD8DB
SUMMARY;LANGUAGE=en-US:2024 Symposium on Reliability for Electronics and Ph
 otonics Packaging (placeholder)
DTSTART;TZID=US Eastern Standard Time:20241107T080000
DTEND;TZID=US Eastern Standard Time:20241108T180000
CLASS:PUBLIC
PRIORITY:5
DTSTAMP:20241015T023423Z
TRANSP:OPAQUE
STATUS:CONFIRMED
SEQUENCE:39
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END:VCALENDAR
