November 2024 - BNC-all - ecn.purdue.edu

IEEE EPS: Paul Wesling In-Person talk on 11/11 (BRK 1001)
by Parimala Vardhan Vydyula 07 Nov '24

07 Nov '24

Hi Neil, I am Vardhan Vydyula, a graduate student in Mechanical Engineering. The IEEE Electronic Packaging Society is hosting an in-person seminar talk by Paul Wesling on "Characteristics of Successful Tech Hubs and Start-ups: Lessons from the Origin and Growth of Silicon Valley" on Monday, November 11th, from 12:00 pm to 1:00 pm at BRK 1001. Lunch will be served. Can you please help publicize the event among the Birck community? I am attaching the flyer to this email. The link to registration is https://r4.ieee.org/cis-eps/?p=695<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fr4.ieee.o…> Thank you! Best regards, Vardhan __________________________________________ Vardhan Vydyula Graduate Research Assistant Cooling Technologies Research Center School of Mechanical Engineering Purdue University, West Lafayette, IN. Secretary, IEEE EPS Central Indiana Chapter

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FW: Purdue University CCE Construction Seminar Nov. 8
by Dilley, Neil R 07 Nov '24

07 Nov '24

CIVIL ENGINEERING AND SEMICONDUCTOR CHIPS MANUFACTURING IN HIGH TECH ERA LUH-MAAN CHANG ENDOWED CHAIR FOR HIGH-TECH FAB ENGINEERING, ENGINEERING COLLEGE DIRECTOR OF HIGH-TECH FACILITY RESEARCH CENTER, CIVIL ENGINEERING DEPARTMENT NATIONAL TAIWAN UNIVERSITY NOVEMBER 8, 2024 11:30 AM — 12:20 PM STEW G52 ZOOM LINK: https://bit.ly/3OCt6nj<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fbit.ly%2F…> [cid:image001.png@01DB30F5.F8CCBE50]

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2024 Symposium on Reliability for Electronics and Photonics Packaging (program schedule pdf attached)
by Wei, Tiwei 07 Nov '24

07 Nov '24

Here is the zoom link for the symposium. Join Zoom Meeting https://purdue-edu.zoom.us/j/95751672483?pwd=NuLFDlze0idlcULCx5siCDy6uW99MY…<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue-ed…> Meeting ID: 957 5167 2483 Passcode: 345582 --- One tap mobile +13126266799,,95751672483#<tel:+13126266799,95751672483>,,,,*345582# US (Chicago) +16465588656,,95751672483#<tel:+16465588656,95751672483>,,,,*345582# US (New York) --- Dial by your location • +1 312 626 6799<tel:+13126266799> US (Chicago) • +1 646 558 8656<tel:+16465588656> US (New York) • +1 646 931 3860<tel:+16469313860> US • +1 301 715 8592<tel:+13017158592> US (Washington DC) • +1 305 224 1968<tel:+13052241968> US • +1 309 205 3325<tel:+13092053325> US • +1 564 217 2000<tel:+15642172000> US • +1 669 444 9171<tel:+16694449171> US • +1 669 900 6833<tel:+16699006833> US (San Jose) • +1 689 278 1000<tel:+16892781000> US • +1 719 359 4580<tel:+17193594580> US • +1 253 205 0468<tel:+12532050468> US • +1 253 215 8782<tel:+12532158782> US (Tacoma) • +1 346 248 7799<tel:+13462487799> US (Houston) • +1 360 209 5623<tel:+13602095623> US • +1 386 347 5053<tel:+13863475053> US • +1 507 473 4847<tel:+15074734847> US Meeting ID: 957 5167 2483 Passcode: 345582 Find your local number: https://purdue-edu.zoom.us/u/aeqITTNUAV<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue-ed…> --- Join by SIP • 95751672483(a)zoomcrc.com<mailto:95751672483@zoomcrc.com> --- Join by H.323 • 162.255.37.11 (US West) • 162.255.36.11 (US East) Meeting ID: 957 5167 2483 Passcode: 345582 Dear all, The final symposium program schedule is attached in this calendar invitation. Looking forward to seeing you all next week. The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001, in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability: (1) Reliability for Thermal, Mechanical, and Cooling Systems (2) Reliability for Analog/RF and Power Integrated Circuits (3) Reliability for Photonics (4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. We look forward to seeing you at REPP 2024! [cid:image001.png@01DB2CAB.47AA8970][cid:image002.png@01DB2CAB.47AA8970] [cid:image003.png@01DB2CAB.47AA8970][cid:image004.png@01DB2CAB.47AA8970]

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Join Us for a SPIE & IEEE Professional Development & Social Event – Free Lunch and Business Card Printing!
by SPIE Purdue University Student Chapter, 06 Nov '24

06 Nov '24

Hello Everyone, We’re excited to invite you to a Professional Development & Social Event hosted by the Purdue SPIE & IEEE Photonics Society Student Chapter! This event is a fantastic opportunity to connect, learn, and enjoy free lunch. Event Details: * Location: BHEE 117 (Please see the attached poster for directions) * Date: Friday, November 8 * Time: 12:00 PM - 1:00 PM * Signup: https://forms.office.com/r/HnqeNMmpZx?origin=lprLink<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fforms.off…> Come join us for: * A free lunch * Free business card printing: Don't forget to pick them up this week!! * Insightful talks: Dr. Colton Fruhling will deliver a special lecture on creating a Professional figure workflow—an essential skill for publishing a paper! * networking opportunities We hope to see you there! Best regards, SPIE & IEEE Purdue Student Chapter " Thank you so much. Best regards, SPIE & IEEE student chapter

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Another Cleanroom Garment Reminder!
by Reger, Ronald K 06 Nov '24

06 Nov '24

Dear Cleanroom Users, This is another reminder that cleanroom garments should be re-used as much as possible. We're still experiencing a critical shortage of hoods, coveralls, & boots and we need all users to make sure to re-use your cleanroom garments as much as possible. Please hang them up on your assigned hanger when you leave the cleanroom, and only put them into the dirty garment hamper when they have been soiled or stained by photoresist, etc. We have 350 coveralls in our agreement/pipeline with the supplier. Yesterday we cleaned out the dirty garment hamper completely and today it was ¾ full of garments (approximately 40 garments discarded as 'dirty'). We need your immediate attention to this critical detail so we will have cleanroom garments for all our users. Let me know if you have any questions. Ron Ron Reger Engineering Manager Birck Nanotechnology Center | Room 2289 | Office: 765.494.6667 | Email: rreger(a)purdue.edu<mailto:rreger@purdue.edu> Wiki: https://wiki.itap.purdue.edu/display/BNCWiki iLabs: https://purdue.ilabsolutions.com/homepage/<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue.il…>

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2024 Symposium on Reliability for Electronics and Photonics Packaging (program schedule pdf attached)
by Wei, Tiwei 01 Nov '24

01 Nov '24

Dear all, The final symposium program schedule is attached in this calendar invitation. Looking forward to seeing you all next week. The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001, in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability: (1) Reliability for Thermal, Mechanical, and Cooling Systems (2) Reliability for Analog/RF and Power Integrated Circuits (3) Reliability for Photonics (4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2…>. We look forward to seeing you at REPP 2024! [cid:image001.png@01DB2CAB.47AA8970][cid:image002.png@01DB2CAB.47AA8970] [cid:image003.png@01DB2CAB.47AA8970] [cid:image004.png@01DB2CAB.47AA8970]

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