January 2022 - BNC-all - ecn.purdue.edu

BNC News: Week of January 31st
by Abrol, Sangeeta Saddul 31 Jan '22

31 Jan '22

[cid:image006.png@01D7401C.A3F567B0] Seminars /Workshops / Events/Announcement Workshop Quantum Programming Workshop for Purdue Women Engineers and Scientists Date & time: Feb 25th 2022, 11:59 AM to 4:00 PM In-Person Location: Neil Armstrong Hall of Engineering Room 2008 (Virtual attendees can use Zoom) Open registration: https://purdue.ca1.qualtrics.com/jfe/form/SV_3yifGFEsUYmUX8q Learning from the history of the digital revolution in which women played a significant role in driving software development in the early days, the IQPARC project is paying particular attention to attracting women scientists and engineers from different disciplines at Purdue. IQPARC is holding a half-day hands-on hybrid workshop (lunch provided for in-person attendees at 11:30 am) for women engineers and scientists at Purdue. The workshop features webinars by Industry leaders, e.g., Microsoft, IonQ, and Quantum Computing Inc., and Purdue's Professors and students on the following topics: * Introduction to IQPARC (10min) Prof. Mahdi Hosseini (Purdue ECE) * Introduction to IonQ quantum processors (50min) Sarah Kreikemeier, Senior Mechanical Engineer, IonQ Inc. (NYSE: IONQ) * Cloud quantum programming, Microsoft Azure Quantum (120min) Mariia Mykhailova, Principal Software Engineer at Microsoft Quantum * Solving optimization problems with quantum computers, Quantum Computing Inc.(50min) QCi Presenter: TBA * Cloud quantum programming using IBM Qiskit language (50min) Purdue student presenter: Ganga Jayarathna, recorded video will be available on IQPARC.com after the workshop All attendees will receive a certificate of competition from IQPARC. Moreover, attendees will have opportunities to participate in follow-up programming events (with free access to quantum computers) and apply for awards and summer scholarships offered by IQPARC. To learn more about the Center for Innovation in Quantum Pedagogy, Application and its Relation to Culture (IQ-PARC), please visit the home page at https://www.iqparc.com Questions can be directed to: lidongyang(a)purdue.edu<mailto:lidongyang@purdue.edu> This effort is supported by the National Defense Education Program (NDEP-STEM) under Grant No. HQ0034-21-1-0014 [cid:image007.jpg@01D81133.C6F37D40] Announcement Mask Protocols in the Cleanroom We have observed various masking practices in the cleanroom recently so as a reminder for those using our Birck cleanroom, please continue to follow our COVID mask protocols. Masking requirements are either to use an M3 N95 mask by itself or use a standard mask under the cleanroom veil. If you have any questions please contact a staff member. Thanks, Ron Birck Engineering Mask Protocols (REMINDER) Dear All Birck Users, Please remember that masks are required to be worn at all times when in Purdue buildings. The exceptions are when eating, drinking or when actively exercising at the Recreation Facilities. The official Purdue policy states: "Masks are currently required inside all campus buildings, regardless of vaccination status. Full Protect Purdue masking protocols are available online. Violations of these protocols will be considered violations of the Protect Purdue Pledge and will be subject to disciplinary action." We've had reports of Birck users passing through Bindley with no masks. Please follow these masking requirements whether in Birck, Bindley, or any other campus building. Thanks for your support and cooperation. Ron Reger New Employee We are pleased to welcome Michelle Radtke to the Birck team as our New Logistic Coordinator. Michelle has joined us today. Mark Voorhis Building Manager Birck Events<https://www.purdue.edu/discoverypark/birck/events/index.php> and Birck News<https://www.purdue.edu/discoverypark/birck/news/index.php> JOB POSTINGS: R&D Senior Design Engineer at Alpha & Omega Semiconductor Alpha & Omega Semiconductor is looking for a Senior Design Engineer who will work in a dynamic team environment at AOS headquarter located in Sunnyvale, CA. The main responsibility of this position is to work with marketing/process integration/product engineering group to develop silicon power device technology. Application link: Senior Design Engineer - Sunnyvale, CA - Alpha & Omega Semiconductor Jobs (applicantpro.com)<https://caosmd.applicantpro.com/jobs/2050960.html> R&D Senior Process Integration Engineer at Alpha & Omega Semiconductor Alpha & Omega Semiconductor is looking for a Senior Process Integration Engineer who will work in a dynamic team environment at AOS Semiconductor's leading technology fabrication facility (Jireh Semiconductor) located in Hillsboro, Oregon. The focus of this position is to work with device/process module/product engineering group to develop silicon power device process technology and improve existing technology yield. Primary responsibilities are to process flow implementation, electrical characterization (failure analysis), and wafer level testing yield monitoring. Application link: Entry Level MS or PHD Process Integration R&D Engineer - Hillsboro, OR - Jireh Semiconductor Jobs (applicantpro.com)<https://aosmd.applicantpro.com/jobs/1949301.html> Opening in OxideMEMS lab Sunil Bhave's OxideMEMS Lab <https://engineering.purdue.edu/oxidemems/publications.html> explores inter-domain coupling in Opto-mechanical, Spin-Acoustic and Atom-MEMS devices. PhD, Postdoctoral and Research Associate positions are available in these areas: * Superconducting qubit and cryo-CMOS circuits * Resonators and switches * MEMS-engine for LIDAR * Piezo-on-nitride transducers for atom-mechanics Expertise in many and most of Microfabrication, PiezoMEMS, Photonics, Quantum Mechanics, Microwave circuits, PCB design, ADS/HFSS, Comsol, Python and Labview is required. Please send CV to bhave(a)purdue.edu<mailto:bhave@purdue.edu> if you are interested link<http://interested.link> Graduate Research Assistantship Opportunity: Deposited Gate Oxides for SiC MOSFETs Up to two graduate research assistantships are available in the area of silicon carbide metal-oxide-semiconductor (MOS) devices. SiC is a wide bandgap semiconductor with a high critical field, making it an exciting material for power electronic devices. SiC MOSFETs are now commercially available, but do not yet achieve their full potential. Our group is approaching this problem from several directions, including a new device trench MOSFET geometries inspired by modern FinFETs and alternative gate insulator fabrication methods. Research activities will include fabrication and characterization of SiC MOS capacitors and MOSFETs with gate oxides formed by thermal oxidation, atomic layer deposition (ALD), and other methods. The student will gain a detailed understanding of the physics of the MOS interface and will learn various methods of characterizing devices, including MOS CV analysis, interface state density and carrier mobility. For more information or to apply, send resume and contact information to: Dallas Morisette Research Assistant Professor morisett(a)purdue.edu<mailto:morisett@purdue.edu> [cid:image014.png@01D81133.C6F37D40] Department of Health and Human Services National Institutes of Health Postdoctoral Fellow Position in the NIBIB's Section on Mechanobiology Fields: Mechanobiology, Biophysics, Engineering, High-resolution Imaging, Cell Biology, Developmental Biology Research Project Title: Mechanobiology of Self-Organization in Cancer Project Description: The NIBIB's Section on Mechanobiology (https://www.nibib.nih.gov/labs-at-nibib/section-mechanobiology) at the National Institutes of Health is recruiting a Staff Scientist. The focus of the Cartagena-Rivera lab the development and use of advanced Atomic Force Microscopy (AFM) tools for cellular and tissue mechanics investigation. We seek to understand several important biological processes by applying physics and engineering principles, particularly: the molecular-mechanical regulation of the actomyosin cortex and glycocalyx of highly malignant cancers (including melanoma, breast, ovarian, and pancreatic); the structural-molecular-mechanical regulation of the solid tumor microenvironment for deciphering self-organization, morphogenesis, and growth in cancer biology; and the anisotropic mechanical properties of developmental and mature inner ear sensory and non-sensory epithelial tissues using a novel noncontact AFM approach. This position will work at the intersection of biophysics, engineering, mathematics, and molecular/cellular/developmental biology to study the mechanobiological regulation of cells and tissues during development and disease. Furthermore, will work on development of new Atomic Force Microscopy-based technologies to study fast multiparametric and multidimensional cellular and tissue processes, advances the state of the art AFM imaging methods for high spati-temporal and quantitative nanomechanical mapping. In addition, will work closely with collaborating cell biologist, geneticists, engineers, and byophysists within and outside the NIH. Qualifications: The candidate must have a Ph.D. degree in cellular biology, biophysics, biomedical or mechanical engineering, or related discipline, with some background in molecular cell biology and developmental biology. The candidate must demonstrate ability to work in a multidisciplinary and diverse team. We are seeking a highly motivated individual who has a demonstrated record of productivity and success in scientific and engineering projects. The candidate must have experience on cellular and tissue mechanics, tissue culture, AFM imaging, high-resolution optical imaging, and programming for data analysis (preferably Julia, Python, MATLAB, or R) and/or experimental devices control (preferably LabVIEW). Position Location: Bethesda, Maryland (NIH main campus) To Apply: Salary is determined by the NIH stipend level for Post-Doctoral Trainees and Fellows.Applicants are invited to submit a curriculum vitae including a list of publications, a maximum one-page summary of research interests, and names and contact details of three referees to Dr. Cartagena-Rivera by email at alexander.cartagena-rivera(a)nih.gov<mailto:alexander.cartagena-rivera@nih.gov>. The National Institutes of Health is an equal opportunity employer. The NIH is dedicated to building a diverse community in its training and employment programs. For more information or to apply, send resume and contact information to: Daniel M. Suter, PhD Professor Department of Biological Sciences Purdue University 915 West State Street West Lafayette, IN 47906 dsuter(a)purdue.edu<mailto:dsuter@purdue.edu> NSAC Fab Forum NSAC Fab Forum every Tuesday 2:00pm-2.30pm NSAC Coffee Hour NSAC Fab Forum every Friday 2:00pm-2.30pm Birck Nanotechnology Center Advanced Capabilities Keithley 4200A Ultrafast Pulse Unit (Probe 2) [cid:image013.jpg@01D8169E.B82CB090] Features: > Ultra-fast I-V module with remote PreAmp ( 4225-PMU & 4225-RPM) > Pulse widths as low as low as 60 ns > Low noise (15uA) and wide measurement range (10-40V) Other Capabilities: > Also measure low noise CV-IV measurements with Cascade [cid:image011.jpg@01D816B9.D106E340] Location: BRK 2100-J Contact: Nithin Raghunathan (nithin(a)purdue.edu)<mailto:nithin@purdue.edu> Please visit the Birck Wiki to learn about the wide array of fabrication and characterization equipment at the facility<https://wiki.itap.purdue.edu/display/BNCWiki/> ***To post an announcement in the weekly BNC E-news please send to Sangeeta Abrol @ abrols(a)purdue.edu***<mailto:abrols@purdue.edu***> Follow us on Facebook and Twitter [Facebook icon]<https://www.facebook.com/nano.purdue.edu/> [Twitter icon] <https://twitter.com/BNCPurdue>

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Possible Winter Storm?
by Reger, Ronald K 31 Jan '22

31 Jan '22

Dear Birck Users, According to the weather forecast our area may get up to 10 inches of snow over the course of Wednesday and Thursday of this week, and it comes on the heels of rain on Tuesday. If it rains Tuesday and we have a sudden drop in temperature we may have significant snowfall on top of ice. Of course this is a weather forecast so it is subject to change significantly one way or the other, but we just wanted the Birck user community to be aware of this possibility. If this happens then there could be a few days delay in our ability to receive bulk gas supply, so anyone who needs long runs requiring Ar, N2, or O2 may want to consider planning for the worst-case scenario of a bulk gas delivery delay. Just for your consideration. Birck Engineering Staff [cid:image001.png@01D8168F.60509DA0][cid:image002.png@01D8168E.DEAC98D0] Ron Reger Engineering Manager Birck Nanotechnology Center | Room 2289 | Office: 765.494.6667 | Email: rreger(a)purdue.edu<mailto:rreger@purdue.edu> Wiki: https://wiki.itap.purdue.edu/display/BNCWiki iLabs: https://purdue.ilabsolutions.com/homepage/

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Reminder Regarding Mask Protocols
by Reger, Ronald K 27 Jan '22

27 Jan '22

Dear All Birck Users, Please remember that masks are required to be worn at all times when in Purdue buildings. The exceptions are when eating, drinking or when actively exercising at the Recreation Facilities. The official Purdue policy states: "Masks are currently required inside all campus buildings, regardless of vaccination status. Full Protect Purdue masking protocols are available online. Violations of these protocols will be considered violations of the Protect Purdue Pledge and will be subject to disciplinary action." We've had reports of Birck users passing through Bindley with no masks. Please follow these masking requirements whether in Birck, Bindley, or any other campus building. Thanks for your support and cooperation. Ron Reger

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BNC News: Week of January 24th
by Abrol, Sangeeta Saddul 24 Jan '22

24 Jan '22

[cid:image006.png@01D7401C.A3F567B0] Seminars /Workshops / Events/Announcement Workshop Quantum Programming Workshop for Purdue Women Engineers and Scientists Date & time: Feb 25th 2022, 11:59 AM to 4:00 PM In-Person Location: Neil Armstrong Hall of Engineering Room 2008 (Virtual attendees can use Zoom) Open registration: https://purdue.ca1.qualtrics.com/jfe/form/SV_3yifGFEsUYmUX8q Learning from the history of the digital revolution in which women played a significant role in driving software development in the early days, the IQPARC project is paying particular attention to attracting women scientists and engineers from different disciplines at Purdue. IQPARC is holding a half-day hands-on hybrid workshop (lunch provided for in-person attendees at 11:30 am) for women engineers and scientists at Purdue. The workshop features webinars by Industry leaders, e.g., Microsoft, IonQ, and Quantum Computing Inc., and Purdue's Professors and students on the following topics: * Introduction to IQPARC (10min) Prof. Mahdi Hosseini (Purdue ECE) * Introduction to IonQ quantum processors (50min) Sarah Kreikemeier, Senior Mechanical Engineer, IonQ Inc. (NYSE: IONQ) * Cloud quantum programming, Microsoft Azure Quantum (120min) Mariia Mykhailova, Principal Software Engineer at Microsoft Quantum * Solving optimization problems with quantum computers, Quantum Computing Inc.(50min) QCi Presenter: TBA * Cloud quantum programming using IBM Qiskit language (50min) Purdue student presenter: Ganga Jayarathna, recorded video will be available on IQPARC.com after the workshop All attendees will receive a certificate of competition from IQPARC. Moreover, attendees will have opportunities to participate in follow-up programming events (with free access to quantum computers) and apply for awards and summer scholarships offered by IQPARC. To learn more about the Center for Innovation in Quantum Pedagogy, Application and its Relation to Culture (IQ-PARC), please visit the home page at https://www.iqparc.com Questions can be directed to: lidongyang(a)purdue.edu<mailto:lidongyang@purdue.edu> This effort is supported by the National Defense Education Program (NDEP-STEM) under Grant No. HQ0034-21-1-0014 [cid:image007.jpg@01D81133.C6F37D40] Announcement Mask Protocols in the Cleanroom We have observed various masking practices in the cleanroom recently so as a reminder for those using our Birck cleanroom, please continue to follow our COVID mask protocols. Masking requirements are either to use an M3 N95 mask by itself or use a standard mask under the cleanroom veil. If you have any questions please contact a staff member. Thanks, Ron Birck Engineering New Employee We are pleased to welcome Michelle Radke to the Birck team as our New Logistic Coordinator. Michelle will be joining us starting on 1/31/2022. Mark Voorhis Building Manager Birck Events<https://www.purdue.edu/discoverypark/birck/events/index.php> and Birck News<https://www.purdue.edu/discoverypark/birck/news/index.php> JOB POSTINGS: R&D Senior Design Engineer at Alpha & Omega Semiconductor Alpha & Omega Semiconductor is looking for a Senior Design Engineer who will work in a dynamic team environment at AOS headquarter located in Sunnyvale, CA. The main responsibility of this position is to work with marketing/process integration/product engineering group to develop silicon power device technology. Application link: Senior Design Engineer - Sunnyvale, CA - Alpha & Omega Semiconductor Jobs (applicantpro.com)<https://caosmd.applicantpro.com/jobs/2050960.html> R&D Senior Process Integration Engineer at Alpha & Omega Semiconductor Alpha & Omega Semiconductor is looking for a Senior Process Integration Engineer who will work in a dynamic team environment at AOS Semiconductor's leading technology fabrication facility (Jireh Semiconductor) located in Hillsboro, Oregon. The focus of this position is to work with device/process module/product engineering group to develop silicon power device process technology and improve existing technology yield. Primary responsibilities are to process flow implementation, electrical characterization (failure analysis), and wafer level testing yield monitoring. Application link: Entry Level MS or PHD Process Integration R&D Engineer - Hillsboro, OR - Jireh Semiconductor Jobs (applicantpro.com)<https://aosmd.applicantpro.com/jobs/1949301.html> Opening in OxideMEMS lab Sunil Bhave's OxideMEMS Lab <https://engineering.purdue.edu/oxidemems/publications.html> explores inter-domain coupling in Opto-mechanical, Spin-Acoustic and Atom-MEMS devices. PhD, Postdoctoral and Research Associate positions are available in these areas: * Superconducting qubit and cryo-CMOS circuits * Resonators and switches * MEMS-engine for LIDAR * Piezo-on-nitride transducers for atom-mechanics Expertise in many and most of Microfabrication, PiezoMEMS, Photonics, Quantum Mechanics, Microwave circuits, PCB design, ADS/HFSS, Comsol, Python and Labview is required. Please send CV to bhave(a)purdue.edu<mailto:bhave@purdue.edu> if you are interested link<http://interested.link> Nanofabrication Contractor Engineer for Microsoft Quantum Microsoft Azure Quantum at Station Q Purdue seeks a nanofabrication engineer in the device fabrication group. You will join a multi-disciplinary team of theoretical and experimental physicists, materials scientists, and hardware and software engineers working at the forefront of quantum computing. You should have experience in device fabrication and characterization techniques. Our work at Station Q Purdue in West Lafayette, Indiana is part of global Microsoft Quantum research effort in topological quantum computing. Responsibilities: Responsibilities include develop, operate, and characterize semiconductor device fabrication processes in the Birck Nanotechnology Center cleanroom facilities located at Purdue University. Accurately documenting and effectively communicating all procedures and results to the larger research group is an essential aspect of the position. The candidate may also be required to assist in the maintenance of equipment. Qualifications: A successful candidate must have: * * Master's degree in Physics, Materials Science or Electrical Engineering. Other engineering disciplines will also be considered. * * Hands-on experience working with some or all of the following semiconductor process areas: lithography, thin film deposition and etch. * * Ability to follow protocols to operate sophisticated experimental equipment and to safely work with industrial solvents, acids, and bases in a cleanroom environment * * Excellent written and oral communication skills. * * Proficiency at accurately documenting processes and protocols. * * Strong attention to detail and good organizational skills. * * Strong desire to work in a collaborative international team. Preference may be given to candidates with the following additional qualifications: * * Industry experience in semiconductor device process integration. * * Expertise in thin film characterization, both structural and electrical. * * Familiarity with design and layout tools for chip scale devices. Please send your resume to flgriggi(a)microsoft.com<mailto:flgriggi@microsoft.com>, selected candidates will be contacted for interviews. Graduate Research Assistantship Opportunity: Deposited Gate Oxides for SiC MOSFETs Up to two graduate research assistantships are available in the area of silicon carbide metal-oxide-semiconductor (MOS) devices. SiC is a wide bandgap semiconductor with a high critical field, making it an exciting material for power electronic devices. SiC MOSFETs are now commercially available, but do not yet achieve their full potential. Our group is approaching this problem from several directions, including a new device trench MOSFET geometries inspired by modern FinFETs and alternative gate insulator fabrication methods. Research activities will include fabrication and characterization of SiC MOS capacitors and MOSFETs with gate oxides formed by thermal oxidation, atomic layer deposition (ALD), and other methods. The student will gain a detailed understanding of the physics of the MOS interface and will learn various methods of characterizing devices, including MOS CV analysis, interface state density and carrier mobility. For more information or to apply, send resume and contact information to: Dallas Morisette Research Assistant Professor morisett(a)purdue.edu<mailto:morisett@purdue.edu> [cid:image014.png@01D81133.C6F37D40] Department of Health and Human Services National Institutes of Health Postdoctoral Fellow Position in the NIBIB's Section on Mechanobiology Fields: Mechanobiology, Biophysics, Engineering, High-resolution Imaging, Cell Biology, Developmental Biology Research Project Title: Mechanobiology of Self-Organization in Cancer Project Description: The NIBIB's Section on Mechanobiology (https://www.nibib.nih.gov/labs-at-nibib/section-mechanobiology) at the National Institutes of Health is recruiting a Staff Scientist. The focus of the Cartagena-Rivera lab the development and use of advanced Atomic Force Microscopy (AFM) tools for cellular and tissue mechanics investigation. We seek to understand several important biological processes by applying physics and engineering principles, particularly: the molecular-mechanical regulation of the actomyosin cortex and glycocalyx of highly malignant cancers (including melanoma, breast, ovarian, and pancreatic); the structural-molecular-mechanical regulation of the solid tumor microenvironment for deciphering self-organization, morphogenesis, and growth in cancer biology; and the anisotropic mechanical properties of developmental and mature inner ear sensory and non-sensory epithelial tissues using a novel noncontact AFM approach. This position will work at the intersection of biophysics, engineering, mathematics, and molecular/cellular/developmental biology to study the mechanobiological regulation of cells and tissues during development and disease. Furthermore, will work on development of new Atomic Force Microscopy-based technologies to study fast multiparametric and multidimensional cellular and tissue processes, advances the state of the art AFM imaging methods for high spati-temporal and quantitative nanomechanical mapping. In addition, will work closely with collaborating cell biologist, geneticists, engineers, and byophysists within and outside the NIH. Qualifications: The candidate must have a Ph.D. degree in cellular biology, biophysics, biomedical or mechanical engineering, or related discipline, with some background in molecular cell biology and developmental biology. The candidate must demonstrate ability to work in a multidisciplinary and diverse team. We are seeking a highly motivated individual who has a demonstrated record of productivity and success in scientific and engineering projects. The candidate must have experience on cellular and tissue mechanics, tissue culture, AFM imaging, high-resolution optical imaging, and programming for data analysis (preferably Julia, Python, MATLAB, or R) and/or experimental devices control (preferably LabVIEW). Position Location: Bethesda, Maryland (NIH main campus) To Apply: Salary is determined by the NIH stipend level for Post-Doctoral Trainees and Fellows.Applicants are invited to submit a curriculum vitae including a list of publications, a maximum one-page summary of research interests, and names and contact details of three referees to Dr. Cartagena-Rivera by email at alexander.cartagena-rivera(a)nih.gov. The National Institutes of Health is an equal opportunity employer. The NIH is dedicated to building a diverse community in its training and employment programs. For more information or to apply, send resume and contact information to: Daniel M. Suter, PhD Professor Department of Biological Sciences Purdue University 915 West State Street West Lafayette, IN 47906 dsuter(a)purdue.edu<mailto:dsuter@purdue.edu> NSAC Fab Forum NSAC Fab Forum every Tuesday 2:00pm-2.30pm NSAC Coffee Hour NSAC Fab Forum every Friday 2:00pm-2.30pm Birck Nanotechnology Center Advanced Capabilities JEOL-8100 FS Electron Beam Lithography [cid:image020.png@01D81133.C6F37D40][JEOL8100FS.jpg] Features: * Fast 125MHz Scanning * Two writing modes -ultra fine and high throughput * Stitching of +/- 9 nm in ultra-fine writing and +/- 20 nm in high throughput * Can write on small substrates up to 200 mm substrates * GenISys BEAMER software used for data fracturing Location: BRK Cleanroom P Bay Contact: Rill Rowe (wrowe(a)purdue.edu) or Dr. Justin Wirth (jcwirth(a)purdue.edu) Please visit the Birck Wiki to learn about the wide array of fabrication and characterization equipment at the facility<https://wiki.itap.purdue.edu/display/BNCWiki/> ***To post an announcement in the weekly BNC E-news please send to Sangeeta Abrol @ abrols(a)purdue.edu***<mailto:abrols@purdue.edu***> Follow us on Facebook and Twitter [Facebook icon]<https://www.facebook.com/nano.purdue.edu/> [Twitter icon] <https://twitter.com/BNCPurdue>

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Micro-Bulk Argon Issue
by Reger, Ronald K 24 Jan '22

24 Jan '22

Dear Birck Researchers, For some reason (unknown at this time, we're investigating) our Argon usage rate doubled last Wednesday, January 19th. Our typical usage is about 0.2 inches per hour but starting on the 19th we increased to 0.4 inches per hour and it stayed at that rate. The end result was it ran our microbulk tank to zero, and since Linde doesn't refill on weekends we have been at zero for the last 24 hours. The engineering staff is shutting down all recharge equipment that uses Argon until we can refill the tank and purge the lines. If there are any faculty-owned instruments we recommend you not run until the Argon is restored and you do an appropriate purge. The Argon truck from Linde is on the way to Birck now to refill the tank. We're working with Linde to enhance our refill notifications that will include not only tank level but also usage rate. If anyone knows why the rate increased last Wednesday we would appreciate you sharing your insight with us. The Engineering Staff

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Deadline Midnight tonight - Laboratory access will be removed if the below is not completed (fifth and final notice)
by Jurss, Stephen E 24 Jan '22

24 Jan '22

Greetings all, It's that time of year again! In order to maintain access to Birck, all BNC laboratory users (including any of the dry, solvent, acid, bio, and cleanroom labs) must obtain this year's annual safety training refresher Passport badge: BNC 151 - 2022 badge<https://www.openpassport.org/Badge/bnc151-2022/Criteria> BNC lab users must obtain this badge by 11:59:59 PM Monday, January 24th, or BNC lab access will be revoked. Please direct any questions or issues to sejurss(a)purdue.edu<mailto:sejurss@purdue.edu> and jcwirth(a)purdue.edu<mailto:jcwirth@purdue.edu>. To begin earning the badge, navigate to the following link and click the "Get Started" button: https://www.openpassport.org/Badge/bnc151-2022/Criteria NOTE: If you do not see the "Get Started" button at the badge page, or cannot access the page at all, you need to join the BNC Passport group: 1. Navigate to the BNC Passport Group page: https://www.openpassport.org/Group/bnc 2. Login with your Purdue ID and BoilerKey (if not already logged in) 3. Once at the BNC Passport Group page, click the "Join Group" button. To reiterate the requirements listed on the badge page, obtaining the badge requires: 1. A review of the BNC 151 - 2022 training slides<file:///C:/Users/jcwirth/AppData/Local/Microsoft/Windows/INetCache/Content.…> and the Chemical Hygiene Plan<https://www.purdue.edu/ehps/rem/documents/programs/chp2014.pdf>. 2. Passing a 25 question quiz on content from the BNC 151 - 2022 training slides<file:///C:/Users/jcwirth/AppData/Local/Microsoft/Windows/INetCache/Content.…> and the Chemical Hygiene Plan<http://www.purdue.edu/ehps/rem/documents/programs/chp2014.pdf>. An 80% or better is required to pass. The quiz may be retaken once, if needed. You may refer to the BNC 151 - 2022 training slides<file:///C:/Users/jcwirth/AppData/Local/Microsoft/Windows/INetCache/Content.…> and the Chemical Hygiene Plan<http://www.purdue.edu/ehps/rem/documents/programs/chp2014.pdf> during the quiz. Please note: * If you fail to obtain an 80% after a second attempt on the quiz, your submission must be manually reset. Email Steve Jurss (sejurss(a)purdue.edu<mailto:sejurss@purdue.edu?subject=BNC%20151%20Quiz%20Reset>) with the subject line "BNC 151 Quiz Reset" to setup a meeting to discuss any points of confusion and reset your submission. * BNC laboratory access (to any/all of the dry, solvent, acid, bio, or cleanroom laboratories) will be revoked if not completed by 11:59:59 PM on Monday, January 24th, 2022. * If not completed by the deadline, users wishing to regain BNC laboratory access will need to: * complete a more extensive version of the badge (50 questions >=90% to pass instead of 25 questions >=80%) * have their PI sign-off on the training * wait for the Friday after their badge is completed for access to be re-instated. Safety Officer Stephen Jurss

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Important- All User Refresher required for Birck access (4th Notice)
by Jurss, Stephen E 21 Jan '22

21 Jan '22

Greetings all, It's that time of year again! In order to maintain access to Birck, all BNC laboratory users (including any of the dry, solvent, acid, bio, and cleanroom labs) must obtain this year's annual safety training refresher Passport badge: BNC 151 - 2022 badge<https://www.openpassport.org/Badge/bnc151-2022/Criteria> BNC lab users must obtain this badge by 11:59:59 PM Monday, January 24th, or BNC lab access will be revoked. Please direct any questions or issues to sejurss(a)purdue.edu<mailto:sejurss@purdue.edu> and jcwirth(a)purdue.edu<mailto:jcwirth@purdue.edu>. To begin earning the badge, navigate to the following link and click the "Get Started" button: https://www.openpassport.org/Badge/bnc151-2022/Criteria NOTE: If you do not see the "Get Started" button at the badge page, or cannot access the page at all, you need to join the BNC Passport group: 1. Navigate to the BNC Passport Group page: https://www.openpassport.org/Group/bnc 2. Login with your Purdue ID and BoilerKey (if not already logged in) 3. Once at the BNC Passport Group page, click the "Join Group" button. To reiterate the requirements listed on the badge page, obtaining the badge requires: 1. A review of the BNC 151 - 2022 training slides<file:///C:/Users/jcwirth/AppData/Local/Microsoft/Windows/INetCache/Content.…> and the Chemical Hygiene Plan<https://www.purdue.edu/ehps/rem/documents/programs/chp2014.pdf>. 2. Passing a 25 question quiz on content from the BNC 151 - 2022 training slides<file:///C:/Users/jcwirth/AppData/Local/Microsoft/Windows/INetCache/Content.…> and the Chemical Hygiene Plan<http://www.purdue.edu/ehps/rem/documents/programs/chp2014.pdf>. An 80% or better is required to pass. The quiz may be retaken once, if needed. You may refer to the BNC 151 - 2022 training slides<file:///C:/Users/jcwirth/AppData/Local/Microsoft/Windows/INetCache/Content.…> and the Chemical Hygiene Plan<http://www.purdue.edu/ehps/rem/documents/programs/chp2014.pdf> during the quiz. Please note: * If you fail to obtain an 80% after a second attempt on the quiz, your submission must be manually reset. Email Steve Jurss (sejurss(a)purdue.edu<mailto:sejurss@purdue.edu?subject=BNC%20151%20Quiz%20Reset>) with the subject line "BNC 151 Quiz Reset" to setup a meeting to discuss any points of confusion and reset your submission. * BNC laboratory access (to any/all of the dry, solvent, acid, bio, or cleanroom laboratories) will be revoked if not completed by 11:59:59 PM on Monday, January 24th, 2022. * If not completed by the deadline, users wishing to regain BNC laboratory access will need to: * complete a more extensive version of the badge (50 questions >=90% to pass instead of 25 questions >=80%) * have their PI sign-off on the training * wait for the Friday after their badge is completed for access to be re-instated. Safety Officer Stephen Jurss

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FW: NEW LINK: John Williams/Boeing Virtual Seminar (Today, 9am)
by Shakouri, Ali 20 Jan '22

20 Jan '22

Sorry about the problem NEW LINK https://purdue-edu.zoom.us/j/92036338991 From: Shakouri, Ali Sent: Thursday, January 20, 2022 8:17 AM To: Shakouri, Ali <shakouri(a)purdue.edu<mailto:shakouri@purdue.edu>> Subject: John Williams/Boeing Virtual Seminar (Today, 9am) Dear All, We will have a special SMART seminar later today Thursday Jan. 20, 2022 (9-10:30am EST). Dr. John Williams, who is Technical Fellow at Boeing and Boeing’s representative at the Manufacturing USA Institute NextFlex, will give a virtual talk about their research in Flexible Hybrid Electronics (see below the abstract). This is a good opportunity to learn about industry interest in this area. Please note that this seminar won’t be recorded and it is only available for live discussion (~45min seminar + 45min questions and answers). Best regards, Ali Flexible Hybrid Electronics - Process Development and Applications John Williams, Ph.D., Technical Fellow Boeing Research and Technology, Huntsville, AL 35824 (256) 937–5904, john.d.williams14(a)boeing.com<mailto:john.d.williams14@boeing.com> Time: Thursday Jan 20, 2022 09:00-10:30 AM EST Boeing is actively engaged in the development of Flexible Hybrid Electronics. We began with single layer processes and have expanded rapidly prototype development of multilayer flexible printed circuit boards (Flex-PCBs) for size weight power and cost saving applications. Flex PCBs allow electronics to be wrapped onto cylindrical or bi-axial curved surfaces. Conventional Flex PCBs contain either one to four copper layers with limited electronic packaging. Most devices are bonded to rigid boards that contain complex packaged electronics. Boeing’s processes, however, apply copper clad or printed inks on polyimide substrates to build fully functional flex-PCBs up to eight conductive layers thick. Thus allowing antennas, sensors, communication links, and radars to be placed directly onto the surface of a vehicle. Similarly, power routing, and microcontrollers can conform to surfaces or interior cavities. This technology represents a transformative approach to packaging PCBs in aerospace applications. Our team has demonstrated this capability on RF boards with no less than 500 through vias, 100 buried vias, and 50 electronically packaged components. Complex boards can be turned in days without electroplating. Pyralux AP polyimide substrates from DuPont, Taconic, and 3M bonding adhesive achieves alignment errors of 2 mil or less over an 8 x 10 square inch area. Kapton substrates can also be used with additional alignment error. Patterning can be completed with either copper clad material or silver ink. Vias are filled using conductive inks. Electronic packaging is currently performed using anisotropic conductive epoxy, but industrially standard solder attach is also available for copper clad and plated devices. Cost models have been completed for printed silver devices, documenting the manufacturability from Manufacturing Readiness Levels (MRL) 4 to 6. We are currently examining pilot capability of different suppliers to manufacture devices at volumes needed for commercial activities. [clip_image001]John D. Williams received his PhD in Engineering Science from LSU in 2004 and became a NextFlex Fellow in 2019 and a Boeing Technical Fellow in 2022. John has 17 years of Principal Investigator experience in device fabrication and is currently the principal investigator on numerous NextFlex contracts focused on antenna arrays and multilayer printing on curved surfaces. John is currently developing Additive Electronics Technologies (AET) for use on Boeing platforms. From 2004 to 2014 he served as a Senior Member of the Technical Staff at Sandia National Laboratories, and as an Assistant Professor of Electrical, Optical and Material Engineering at the University of Alabama in Huntsville (UAH). He joined Boeing in 2014 to found the Boeing Research and Technology AET effort in Huntsville where his team performs novel research in microwave filters, antennas, and flexible hybrid electronic (FHE) sensors by maturing manufacturing capabilities, implementing modeling and simulation, and developing prototype demonstrators. John is the principal / co-principal investigator for 4 concurrent NextFlex MII Projects. He has led, or co-led, 7 other NextFlex projects, serves on the NextFlex Technical Council, and is an industry co-lead for the NextFlex Materials Technical Working Group. He also serves as an industrial committee member for the ManTech JDMTP Electronics Subpanel. In 2021 he served on the organizing committee for the IEEE International Flexible Electronics Technologies Conference (IFETC). John has published more than 30 peer reviewed articles, over 30 US patents, 17 international patents, 4 Boeing trade secrets, and dozens of pending patents. John’s Boeing related inventions on microwave filters, conformal antennas, hyperspectral metrology, and cryogenic cooling of MW class EMI filters are currently being developed for multiple BR&T efforts.

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Re: [BNC-all] BNC News: Week of January 17th
by Abrol, Sangeeta Saddul 18 Jan '22

18 Jan '22

[cid:image006.png@01D7401C.A3F567B0] Seminars /Workshops / Events/Announcement SMART Industry Consortium Special Seminar Flexible Hybrid Electronics - Process Development and Applications John Williams, Ph.D., Technical Fellow Boeing Research and Technology, Huntsville, AL 35824 (256) 937-5904, john.d.williams14(a)boeing.com<mailto:john.d.williams14@boeing.com> Zoom Meeting: https://purdue-edu.zoom.us/j/95587242053 (Note: this seminar won't be recorded) Time: Thursday Jan 20, 2022 09:00-10:30 AM EST Boeing is actively engaged in the development of Flexible Hybrid Electronics. We began with single layer processes and have expanded rapidly prototype development of multilayer flexible printed circuit boards (Flex-PCBs) for size weight power and cost saving applications. Flex PCBs allow electronics to be wrapped onto cylindrical or bi-axial curved surfaces. Conventional Flex PCBs contain either one to four copper layers with limited electronic packaging. Most devices are bonded to rigid boards that contain complex packaged electronics. Boeing's processes, however, apply copper clad or printed inks on polyimide substrates to build fully functional flex-PCBs up to eight conductive layers thick. Thus allowing antennas, sensors, communication links, and radars to be placed directly onto the surface of a vehicle. Similarly, power routing, and microcontrollers can conform to surfaces or interior cavities. This technology represents a transformative approach to packaging PCBs in aerospace applications. Our team has demonstrated this capability on RF boards with no less than 500 through vias, 100 buried vias, and 50 electronically packaged components. Complex boards can be turned in days without electroplating. Pyralux AP polyimide substrates from DuPont, Taconic, and 3M bonding adhesive achieves alignment errors of 2 mil or less over an 8 x 10 square inch area. Kapton substrates can also be used with additional alignment error. Patterning can be completed with either copper clad material or silver ink. Vias are filled using conductive inks. Electronic packaging is currently performed using anisotropic conductive epoxy, but industrially standard solder attach is also available for copper clad and plated devices. Cost models have been completed for printed silver devices, documenting the manufacturability from Manufacturing Readiness Levels (MRL) 4 to 6. We are currently examining pilot capability of different suppliers to manufacture devices at volumes needed for commercial activities. [clip_image001]John D. Williams received his PhD in Engineering Science from LSU in 2004 and became a NextFlex Fellow in 2019 and a Boeing Technical Fellow in 2022. John has 17 years of Principal Investigator experience in device fabrication and is currently the principal investigator on numerous NextFlex contracts focused on antenna arrays and multilayer printing on curved surfaces. John is currently developing Additive Electronics Technologies (AET) for use on Boeing platforms. From 2004 to 2014 he served as a Senior Member of the Technical Staff at Sandia National Laboratories, and as an Assistant Professor of Electrical, Optical and Material Engineering at the University of Alabama in Huntsville (UAH). He joined Boeing in 2014 to found the Boeing Research and Technology AET effort in Huntsville where his team performs novel research in microwave filters, antennas, and flexible hybrid electronic (FHE) sensors by maturing manufacturing capabilities, implementing modeling and simulation, and developing prototype demonstrators. John is the principal / co-principal investigator for 4 concurrent NextFlex MII Projects. He has led, or co-led, 7 other NextFlex projects, serves on the NextFlex Technical Council, and is an industry co-lead for the NextFlex Materials Technical Working Group. He also serves as an industrial committee member for the ManTech JDMTP Electronics Subpanel. In 2021 he served on the organizing committee for the IEEE International Flexible Electronics Technologies Conference (IFETC). John has published more than 30 peer reviewed articles, over 30 US patents, 17 international patents, 4 Boeing trade secrets, and dozens of pending patents. John's Boeing related inventions on microwave filters, conformal antennas, hyperspectral metrology, and cryogenic cooling of MW class EMI filters are currently being developed for multiple BR&T efforts. ************** Zoom Details: Ali Shakouri is inviting you to a scheduled Zoom meeting. Topic: Williams/Boeing (Virtual SMART Seminar Purdue) Time: Jan 20, 2022 09:00 AM America/Indiana/Indianapolis Join Zoom Meeting https://purdue-edu.zoom.us/j/95587242053 Meeting ID: 955 8724 2053 One tap mobile +13126266799,,95587242053# US (Chicago) +16465588656,,95587242053# US (New York) Dial by your location +1 312 626 6799 US (Chicago) +1 646 558 8656 US (New York) +1 301 715 8592 US (Washington DC) +1 346 248 7799 US (Houston) +1 669 900 6833 US (San Jose) +1 253 215 8782 US (Tacoma) Meeting ID: 955 8724 2053 Find your local number: https://purdue-edu.zoom.us/u/adb0xp6lCJ ************** Prof. Venky Narayanamurti's Birck Distinguished Lecture on Dec. 13, 2021 is now available on nanoHUB. See below the link: https://nanohub.org/resources/35749 Rethinking the Nature and Nurture of Discovery Research Venky Narayanamurti Harvard University Abstract Research, particularly on the ?discovery? end of the R&D spectrum, is complex and easily misunderstood. Scientific advance doesn?t always precede, it often follows, engineering advance. Answering questions isn?t always the goal, finding questions often is. We don?t always seek to strengthen conventional wisdom, sometimes we seek to surprise it. What if we could rethink research so that its nurturing, through policy and management, harmonizes with its nature? ************ Workshop Hi All Members of BNC, I will be running CasaXPS workshop to teach how to analyze XPS data from January 18-20,2022 at 9.00am-1.00pm. Registration at: https://forms.gle/GJPLr58Yqugry5Mk6 Best regards, Dmitry ***************************************** Dmitry Zemlyanov, PhD Senior Research Scientist - Surface Science Application Purdue University Birck Nanotechnology Center, 1205 West State Street, West Lafayette, IN 47907-2057 Tel.: +1 (765) 496-2457 (office - BRK 1274) +1 (765) 496-6217 (lab - BRK 1077) Cell: +1 (765) 427-3813 Fax: +1 (765) 496-8299 mailto:dzemlian@purdue.edu web: https://www.purdue.edu/discoverypark/birck/facilities/equipment/Characteriz… Announcement Mask Protocols in the Cleanroom We have observed various masking practices in the cleanroom recently so as a reminder for those using our Birck cleanroom, please continue to follow our COVID mask protocols. Masking requirements are either to use an M3 N95 mask by itself or use a standard mask under the cleanroom veil. If you have any questions please contact a staff member. Thanks, Ron Birck Engineering Birck Events<https://www.purdue.edu/discoverypark/birck/events/index.php> and Birck News<https://www.purdue.edu/discoverypark/birck/news/index.php> JOB POSTINGS: R&D Senior Design Engineer at Alpha & Omega Semiconductor Alpha & Omega Semiconductor is looking for a Senior Design Engineer who will work in a dynamic team environment at AOS headquarter located in Sunnyvale, CA. The main responsibility of this position is to work with marketing/process integration/product engineering group to develop silicon power device technology. Application link: Senior Design Engineer - Sunnyvale, CA - Alpha & Omega Semiconductor Jobs (applicantpro.com)<https://caosmd.applicantpro.com/jobs/2050960.html> R&D Senior Process Integration Engineer at Alpha & Omega Semiconductor Alpha & Omega Semiconductor is looking for a Senior Process Integration Engineer who will work in a dynamic team environment at AOS Semiconductor's leading technology fabrication facility (Jireh Semiconductor) located in Hillsboro, Oregon. The focus of this position is to work with device/process module/product engineering group to develop silicon power device process technology and improve existing technology yield. Primary responsibilities are to process flow implementation, electrical characterization (failure analysis), and wafer level testing yield monitoring. Application link: Entry Level MS or PHD Process Integration R&D Engineer - Hillsboro, OR - Jireh Semiconductor Jobs (applicantpro.com)<https://aosmd.applicantpro.com/jobs/1949301.html> Opening in OxideMEMS lab Sunil Bhave's OxideMEMS Lab <https://engineering.purdue.edu/oxidemems/publications.html> explores inter-domain coupling in Opto-mechanical, Spin-Acoustic and Atom-MEMS devices. PhD, Postdoctoral and Research Associate positions are available in these areas: * Superconducting qubit and cryo-CMOS circuits * Resonators and switches * MEMS-engine for LIDAR * Piezo-on-nitride transducers for atom-mechanics Expertise in many and most of Microfabrication, PiezoMEMS, Photonics, Quantum Mechanics, Microwave circuits, PCB design, ADS/HFSS, Comsol, Python and Labview is required. Please send CV to bhave(a)purdue.edu<mailto:bhave@purdue.edu> if you are interested link<http://interested.link> Nanofabrication Contractor Engineer for Microsoft Quantum Microsoft Azure Quantum at Station Q Purdue seeks a nanofabrication engineer in the device fabrication group. You will join a multi-disciplinary team of theoretical and experimental physicists, materials scientists, and hardware and software engineers working at the forefront of quantum computing. You should have experience in device fabrication and characterization techniques. Our work at Station Q Purdue in West Lafayette, Indiana is part of global Microsoft Quantum research effort in topological quantum computing. Responsibilities: Responsibilities include develop, operate, and characterize semiconductor device fabrication processes in the Birck Nanotechnology Center cleanroom facilities located at Purdue University. Accurately documenting and effectively communicating all procedures and results to the larger research group is an essential aspect of the position. The candidate may also be required to assist in the maintenance of equipment. Qualifications: A successful candidate must have: * * Master's degree in Physics, Materials Science or Electrical Engineering. Other engineering disciplines will also be considered. * * Hands-on experience working with some or all of the following semiconductor process areas: lithography, thin film deposition and etch. * * Ability to follow protocols to operate sophisticated experimental equipment and to safely work with industrial solvents, acids, and bases in a cleanroom environment * * Excellent written and oral communication skills. * * Proficiency at accurately documenting processes and protocols. * * Strong attention to detail and good organizational skills. * * Strong desire to work in a collaborative international team. Preference may be given to candidates with the following additional qualifications: * * Industry experience in semiconductor device process integration. * * Expertise in thin film characterization, both structural and electrical. * * Familiarity with design and layout tools for chip scale devices. Please send your resume to flgriggi(a)microsoft.com<mailto:flgriggi@microsoft.com>, selected candidates will be contacted for interviews. Graduate Research Assistantship Opportunity: Deposited Gate Oxides for SiC MOSFETs Up to two graduate research assistantships are available in the area of silicon carbide metal-oxide-semiconductor (MOS) devices. SiC is a wide bandgap semiconductor with a high critical field, making it an exciting material for power electronic devices. SiC MOSFETs are now commercially available, but do not yet achieve their full potential. Our group is approaching this problem from several directions, including a new device trench MOSFET geometries inspired by modern FinFETs and alternative gate insulator fabrication methods. Research activities will include fabrication and characterization of SiC MOS capacitors and MOSFETs with gate oxides formed by thermal oxidation, atomic layer deposition (ALD), and other methods. The student will gain a detailed understanding of the physics of the MOS interface and will learn various methods of characterizing devices, including MOS CV analysis, interface state density and carrier mobility. For more information or to apply, send resume and contact information to: Dallas Morisette Research Assistant Professor morisett(a)purdue.edu<mailto:morisett@purdue.edu> NSAC Fab Forum NSAC Fab Forum every Tuesday 2:00pm-2.30pm NSAC Coffee Hour NSAC Fab Forum every Friday 2:00pm-2.30pm Birck Nanotechnology Center Advanced Capabilities AJA Ion Mill [cid:image013.png@01D80C3D.1C67E960]<https://wiki.itap.purdue.edu/display/BNCWiki/AJA+ICP+Argon+Ion+Mill+Etcher> * Direct physical milling of thin and thick films using argon atoms. * Water-cooled rotating sample carrier can be oriented 0-90 degrees from normal beam incidence. * Secondary ion mass spectrometer (SIMS) mounted on the system can be used for manual or automatic endpoint detection (EPD) Other Capabilities: * Ion beam source : inductively-coupled argon plasma, accelerated up to 900 V in a 14cm broad beam with currents up to 620 mA (Kaufman & Robinson, Inc.). * Ar+ ions neutralized using a matched electron beam current before reaching the sample. * Sample load-lock system saves time with processing Location: BRK Cleanroom Bay Q Contact: Neil Dilley (ndilley(a)purdue.edu) <mailto:ndilley@purdue.edu> Please visit the Birck Wiki to learn about the wide array of fabrication and characterization equipment at the facility<https://wiki.itap.purdue.edu/display/BNCWiki/> ***To post an announcement in the weekly BNC E-news please send to Sangeeta Abrol @ abrols(a)purdue.edu***<mailto:abrols@purdue.edu***> Follow us on Facebook and Twitter [Facebook icon]<https://www.facebook.com/nano.purdue.edu/> [Twitter icon] <https://twitter.com/BNCPurdue>

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Zeiss presentation - Orion nanofab He ion microscope Friday 01/14 at noon
by Abrol, Sangeeta Saddul 13 Jan '22

13 Jan '22

Dear all, Please find here the link for the Zeiss presentation tomorrow at noon. Zeiss will be talking about the Orion nanofab He ion microscope, capabilities and current applications. They will be also responding to any questions we might have about the system. This talk is open to any potential user so you can pass this link to any student, researcher, or faculty that might be interested. Best, Rosa Topic: Zeiss Orion Nanofab talk Time: Jan 14, 2022 12:00 PM Indiana (East) Join Zoom Meeting https://purdue-edu.zoom.us/j/94584316151?pwd=Y3JOYjFhSlhrT0ZWUG0wOVROamhvQT…<https://eur01.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue-ed…> Meeting ID: 945 8431 6151 Passcode: zeiss One tap mobile +13126266799,,94584316151#,,,,*442850# US (Chicago) +16465588656,,94584316151#,,,,*442850# US (New York) Dial by your location +1 312 626 6799 US (Chicago) +1 646 558 8656 US (New York) +1 301 715 8592 US (Washington DC) +1 346 248 7799 US (Houston) +1 669 900 6833 US (San Jose) +1 253 215 8782 US (Tacoma) Meeting ID: 945 8431 6151 Passcode: 442850 Find your local number: https://purdue-edu.zoom.us/u/acK318mAQC<https://eur01.safelinks.protection.outlook.com/?url=https%3A%2F%2Fpurdue-ed…> ─────────────────────────────────── Rosa E. Diaz, PhD Electron Microscopy Research Scientist Birck Nanotechnology Center Purdue University 1205 W. State Street, West Lafayette, IN 47907-2057 Office: BRK-1272 Tel :765-496-1075 ───────────────────────────────────

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