November 2017 - BNC-all - ecn.purdue.edu

Kenle Chen Seminar - Friday, Dec. 1st @ 2:00pm in WANG 3043
by Turner, Jaime J 29 Nov '17

29 Nov '17

Kenle Chen Seminar DECEMBER 1, 2017 2:00 PM - 3:00 PM WANG 3043 Demystify RF Front-End: Recent Advances and Future Trends Toward 5G Bio: Dr. Kenle Chen earned Ph.D. degree in Electrical Engineering from Purdue University in 2013. He is currently an Assistant Professor with Electrical, Computer, and Biomedical Engineering Department, University of Rhode Island. Prior to his current position, he worked as a Staff RFIC Engineer with Skyworks Solutions from 2015-2017, where he focused on development of RF frontend modules for the emerging Smart-Phone platforms. From 2013 to 2015, he worked as Principal/Lead RFIC Engineer with innovational startups, where he led the Research & Development of multiple successful products of CMOS integrated power amplifiers and frontend solutions for the latest WLAN platforms, e.g., IEEE802.11ac/ax. As a graduate researcher at Purdue University from 2008 to 2013, he made significant contributions in high-efficiency broadband power amplifiers and co-design of reconfigurable RF circuits for smart communication systems. Dr. Chen was a recipient of 2012 IEEE MTT-S graduate fellowship. He was the winner of the High Efficiency Power Amplifier Design Competition in IEEE MTT-S International Microwave Symposium (IMS) from 2011 to 2012, consecutively. He is an active reviewer for more than 10 international journals including IEEE T-MTT, T-BCAS, T-CAS I/II, MWCL, etc. Abstract: In the past decade, the explosive growth of mobile wireless applications has triggered insatiable demand for high data rate of wireless communication, reflected by a tremendous increase of data transmission speed from kbit/s level (2G) to sub-Gbit/s level (4G). Such a data-centric ecosystem has been the major driven force behind the evolution of wireless radio technology. Within the scope of this seminar, I will present the latest advances of radio frontend (RFFE) technology in wireless industry, including the state-of-the-art RFFE architectures in emerging mobile platforms, demystification of RFFE terminology, carrier aggregation, and envelope tracking. Moreover, this talk will overview the general trends and major challenges in RFFE development towards future generations (e.g., 5G). It is clearly envisioned that the future wireless communication will exploit a massively extended spectrum up to millimeter wave range, targeting for order(s)-of-magnitude improvement of speed, latency, capacity, etc. As a key enabler to this evolution, next-generation RFFE modules will call for ultra-high linearity, wideband, high efficiency and ultimate flexibility. Moreover, integration of RFFE on Silicon together with other functional blocks is also highly desirable, truly enabling the concept of System-On-Chip (SOC). Contact Details * Jaime Turner * jjturner(a)purdue.edu<mailto:jjturner@purdue.edu> * 43509 Jaime Turner Administrative Assistant to the Director Birck Nanotechnology Center | Room 1027 | W. Lafayette, IN Office: 765.494.3509 | Fax: 765.496.8383 | Email: jjturner(a)purdue.edu<mailto:jjturner@purdue.edu> ______________________________________________________________ [cid:image001.jpg@01D36926.107C1F40]

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3D3C Newsletter - October 2017
by Kwok, Tim 29 Nov '17

29 Nov '17

Dear All, Below please find the twelfth issue of the newsletter of the 3D Cell Culture Core (3D3C) Facility of the Birck Nanotechnology Center. The newsletter is also available online (https://nanohub.org/groups/3d3cfacility/news<https://secure-web.cisco.com/1--ZQCMqlCOUkLpi0munkkBp4stfTabydGCHayyeghWe3l…>). The four sections in the newsletter are: 3D at Purdue – this section highlights 3D cell culture-based research activity at Purdue 3D in focus – this section presents the current work on a specific 3D cell culture model or technique 3D in publications – this section brings a collection of recent publications on 3D cell culture 3D in meetings – this section includes a list of upcoming meetings related to 3D cell culture The newsletter will be available every two months. If you do not wish to receive the 3D3C newsletter in the future, please reply “cancel” to unsubscribe. Please contact me if you have questions. Yours Sincerely, Tim Kwok Facility Manager 3D Cell Culture Core (3D3C) Facility Birck Nanotechnology Center Purdue University ________________________________ [https://secure-web.cisco.com/1T3saNnSupk0DX27OLn_KKb16ecnfl6gV-m8RUQnH4pObB…] Volume 12, October 2017 [https://secure-web.cisco.com/1y6GyrE2OPItDrkj6Gg1cLQb0bC1f2mIpqXzT4qz9zvFGP…] 3D at Purdue 3D in Focus 3D in Publications 3D in Meetings 3D at Purdue Using Laser Capture Microdissection as an Initial Tool to Investigate Mechanisms of Plant Root Immunity Denise Caldwell and Anjali S. Iyer-Pascuzzi Department of Botany and Plant Pathology Roots are key not only to plant water and nutrient uptake, but also for plant defense against soilborne pathogens. Nearly 90% of the major plant diseases affecting crops in the United States are caused by soilborne pathogens. A subset of these are root vascular wilts. Soilborne bacteria and fungi that cause vascular wilt diseases first infect plant roots by colonizing water-conducting root tissue known as xylem, which prevents water movement to the shoot, resulting in plant death. The best means of disease control is through resistant varieties, but the mechanisms underlying resistance are not clear. In the Iyer-Pascuzzi laboratory, our goal is to understand the molecular basis of root immunity to pathogenic soil microbes. We focus on the soilborne bacterium R. solanacearum, the causal agent of bacterial wilt and ranked within the top 10 most destructive plant bacterial pathogens. Root-mediated resistance to R. solanacearum is fundamental to whole plant resistance. We have previously shown that bacteria differentially colonize the root systems of susceptible and resistant plants. Xylem colonization by bacteria is critical to disease progress, and in roots of susceptible plants, bacteria are able to enter and colonize the xylem within 24 hours. At this same time point in resistant plants, bacteria are still found at the outer root cell types. We hypothesize that root cell-type and tissue-specific gene expression is required to prevent R. solanacearum from entering the xylem of resistant plants. To test this, we are using Laser Capture Microdissection (LCM) to harvest specific cell types and tissues in the resistant and susceptible root, including the root cortex and vasculature, at different time points after inoculation with our pathogen. After harvest, we extract RNA and will use RNA-seq to identify genes that are differentially expressed between mock and inoculated root tissues. Using reverse genetics, we aim to identify tissue-specific genes that contribute to root defense mechanisms. Words from 3D3C: The featured article describes a success story from Dr. Iyer-Pascuzzi’s laboratory of using the LCM system in the 3D3C Facility. LCM is a technique used for isolating cells from a tissue section, cytological preparation or live cell culture via direct visualization of the cells. Unlike other existing methods, e.g. flow cytometry, LCM isolates the cells without disturbing the in situ environment. The technique will also be useful for research in 3D cell cultures that are composed of heterogeneous cell populations. The LCM system in the 3D3C is the latest version of Applied Biosystems® ArcturusXT™ Laser Capture Microdissection System. The system is a unique user-friendly microdissection instrument that combines infrared (IR) laser capture microdissection (LCM) and ultraviolet (UV) laser cutting in one platform. The unique combination of IR laser capture and UV laser cutting permits the collection of selective population, down to a single cell level, of tissues and cells on any slide type and sample preparation, such as thin or thick sections, frozen or formalin-fixed tissues, chromogenic stained or unstained sections, and live cell cultures. Contact Tim Kwok at x46697 or kwokt(a)purdue.edu<mailto:kwokt@purdue.edu>. [https://secure-web.cisco.com/18HGDcdJF8dQcvZ87Us3ZDVmP6DOYs3bWRSoW6BwD-VWPf…]<https://secure-web.cisco.com/18HGDcdJF8dQcvZ87Us3ZDVmP6DOYs3bWRSoW6BwD-VWPf…> Steps used in capturing cells with the Laser Capture Microdissection system. (A) Cross section, (B) selection of the desired cells, (C) laser capture of cells, (D) removal of captured cells, (E) remaining section, (F) captured cells. ________________________________ 3D in Focus The formation of new blood vessels in the tumor microenvironment is essential for tumor progression. Cancer associated fibroblasts (CAFs) are a subpopulation of cells that reside within the tumor microenvironment. CAFs through their secretory and mechanical activities promote the cancerization process by acting on angiogenesis, inflammation and metastasis. While CAF signaling pathways, e.g. VEGF, have been extensively studied, the role of CAF-generated mechanical forces in vascularization is poorly understood. By coculturing endothelial cells (ECs) with CAFs in 3D fibrin gels with embedded magnetic microbeads coated with thrombin, the studies confirm that mechanically perturbing CAFs affects their effect on vascularization. Mary Kathryn Sewell-Loftin, Samantha Van Hove Bayer, Elizabeth Crist, Taylor Hughes, Sofia M. Joison, Gregory D. Longmore, and Steven C. George. Cancer-associated fibroblasts support vascular growth through mechanical force. Scientific Reports (2017) 7: 12574 3D3C summary of the article: When cocultured with ECs, patient-derived breast CAFs supported the formation of interconnected vascular networks in 3D fibrin gels while normal breast fibroblast (NBFs) did not. However, CAF conditioned medium only moderately rescued blood vessel growth in NBF samples, demonstrating that soluble factors alone are not sufficient to explain the enhanced blood vessel growth in the presence of CAFs. The CAFs produced significantly higher deformations in the gel compared to NBFs, as shown by gel deformation measurements done by tracking the displacement of beads embedded in the gel. Subjecting the gel containing thrombin-coated magnetic beads to a magnetic field moving at 30 or 50 rpm demonstrated an increase in blood vessel growth in samples containing either ECs, NBFs, or CAFs. Increasing rotation speed to 100 rpm, however, showed no further increase in supported vessel growth. Static magnetic stimulation, for which a magnet was placed adjacent to the gel for the duration of the experiment, induced a slight increase in vascular formation. These studies support that mechanical deformations or perturbations of the extracellular matrix regulate the growth of blood vessels as promoted by CAFs in the tumor microenvironment. Comments from 3D3C: The conventional way to generate mechanical stimulus in hydrogels is by changing the concentration of polymers or cross-linkers. The system used by Sewell-Loftin and colleagues provides another method for mechanical stimulation as illustrated here in fibrin gel. One of the advantages of this magnet-based system is the ability to switch on and off the mechanical force if needed without disrupting the hydrogel, enabling the dissection of kinetics for mechanotransductive pathways in cells. Even though the present study is focused primarily on CAFs, the same system can also be used for other cell systems such as endothelial cells and other types of fibroblasts (e.g. normal human lung fibroblasts). The limitation of the present system is that requires using fibrin hydrogel since the interaction between thrombin and fibrin is required. Possibly, in the future, a similar concept can be used with gels made of matrix representing the microenvironment of the cells of interest. ________________________________ 3D in Publications Recent publications on 3D culture (please click to access the list on our web page https://nanohub.org/groups/3d3cfacility<https://secure-web.cisco.com/1XOVy6CysmV6r_U3i-sTwndP_edvbQhOpObAb2Yu8ByxR8…>): Review<https://secure-web.cisco.com/1lJ2vrvyml1Pb2jhAww-cco_o0HfHM-wAJcfvDChMTFjBy…> The research articles and reviews are arranged in the following categories: Scaffold free/Scaffold Organ/Tissue/Cell Others Spheroids<https://secure-web.cisco.com/13Zd53pCqUpKDAYsNEOMdZkojYjwe-F2j3dFHbgoLrfSXN…> Organoid<https://secure-web.cisco.com/1ChwFpMMLt_-BKlO5jQBmlgYKk1tgi0N9hpzwaISVOcge0…> Scaffold<https://secure-web.cisco.com/1ZMVRScEYsqm2a4R7uHN_uNa0HnjbgdkzrtE9pL_EKHeNw…> Hydrogel<https://secure-web.cisco.com/19f3SFconpXbRClhjks4ypK0NkBVxhxjgnniHzY2PKLqE_…> Matrix<https://secure-web.cisco.com/1yPj8QPLYww0ozgaA54A3y1NIJi8iLb3Za8dtQXuszXwWG…> Microfluidics<https://secure-web.cisco.com/1EeWBdwYQT6-x8gQtyPAFUdlLP4liPCUmSfCkbhCVy0-MW…> Microfabrication<https://secure-web.cisco.com/1I428IyfNn2IxV6fxf4VcnloVbYuFrkuofUUgjx1h7Tdi2…> Bone<https://secure-web.cisco.com/1F3VkXI67m08FOW_VWeMRDIAupg4u3-J7sYnrGkXp7c3pe…> Bone Marrow<https://secure-web.cisco.com/1PZPLPvqE95MUUdEeT578qVgnV_fhCjjDsDr257Rz3M56L…> Breast<https://secure-web.cisco.com/1pVw7wr81WEbySanUf0vpLL_bSeTXp-sRoc3uoLJ1PAAtQ…> Colon<https://secure-web.cisco.com/1zO82eCOI67kNFeFbjXmBSKI1FTIDQbX7w_3mAXZzRrMJU…> Heart<https://secure-web.cisco.com/1IF7d1_mVhPT3dobbBMT_IragJLFFHihmx-wdld2hB0hht…> Liver<https://secure-web.cisco.com/1sDhWFnq6Wk3h7Efv-aKWWmN0uvvPzk9_SbcNdT_ZtB1yT…> Lung<https://secure-web.cisco.com/1XKYbStp6zlniQQGBzU4f0gduMoTau1U5yyvmIesFpsMaY…> Muscle<https://secure-web.cisco.com/1nsY7-8s6Mdq5cBxwOHeJssT5lSqxhlKgryxmg_rLOAIBA…> Nerve<https://secure-web.cisco.com/1XDdXE9PsX2kcHxh9XrPxCjsnI9bBtfoJTwIBr-X-yhNle…> Prostate<https://secure-web.cisco.com/1OKCSdIG-FjetUP7sB9jxROl__lqxJgjXuosW82V3jVeWY…> Endothelial cells<https://secure-web.cisco.com/1mMRjE0Es1bTPO3ZRVDc6aORwFFO2DOYZM4IeVhkNU23BV…> Fibroblast<https://secure-web.cisco.com/1ME0Ff3dLTMszvkxzHTaisaA3AGSwV5QGnG5KvsY5WW8tt…> Stem Cells<https://secure-web.cisco.com/1tcKIys0VRc2OUB_Vpsxz1_q5P-fyj3gvf2RXtgdwJCOCJ…> Stromal Cells<https://secure-web.cisco.com/1wGdn4qsNcNpaqfpUC21tB3ekMu0AtrwmfCMYIMLYrJbGG…> Cancer/Tumor<https://secure-web.cisco.com/1tZkuX74he1pPmG3tIXAUbFWtuQwKI_XK_cS0HX-AE3rFo…> Screening<https://secure-web.cisco.com/1iElg3OTCAONrTpECvnXZI-H5th_vx8IDex4B2kXLqFSG4…> 3D bioprinting<https://secure-web.cisco.com/1iiuXREQBrZ-004WFtxqYaj-NuEd2HcKDSJRUTBJ9sKzp_…> Imaging<https://secure-web.cisco.com/1N7Q8r-5Kv6eS47YzLE53diYCFV19OEfqu9tEhh783V2Is…> ________________________________ 3D in Meetings International Translational and Regenerative Medicine Conference Date: 1st to 3rd November 2017 Location: Barcelona, Spain Website: http://itmc.madridge.com/<http://secure-web.cisco.com/1FbExhs2hmDcHnJeGBt3SR2AUXW3SNg1pI-Ruw8MFQ5DZpq…> Contact person: Samatha R High-Content Analysis & 3D Screening Date: 6th to 8th November 2017 Location: Cambridge, Massachusetts, USA Website: HighContentAnalysis.com <http://secure-web.cisco.com/1oGLemnayF4-7_ubFkVuRpw9JjhVeqAtaZwP2SHk0AwXHoJ…> Contact person: Jaime Parlee Organized by Cambridge Innovation Institute World Preclinical Congress Europe 2017 Date: 15th to 17th November 2017 Location: Lisbon, Portugal Website: http://worldpreclinicaleurope.com<http://secure-web.cisco.com/1xYI8EOjFklSfZu_Z9a3LZKJA-dJ9EaeOa42v0NZRqPeRi2…> Contact person: Bethany Gray Organized by: Cambridge Healthtech Institute International Biotechnology and pharmaceutical Industry Forum Date: 11th to 13th December 2017 Location: New Delhi, India Website: http://biopharma-forum.com/#1<http://secure-web.cisco.com/1Z9_XRvYwcNDJdnI-eqwLTlQee9eCMzPkMs4X4HNe84B_J8…> Contact person: sangavi Organized by: Clyto access Deadline for abstracts/proposals: 25th April 2017 ITMC-2017-Aims to discover advances in health practice & in relation to health disparities, as well as a breadth of other topics. Need for translational medicine, Challenges in translational medicine, Opportunities in translational medicine. 3D Cell Culture Date: 21st to 22nd February 2018 Location: London, United Kingdom Website: https://www.smi-online.co.uk/pharmaceuticals/uk/3D-Cell-Culture<https://secure-web.cisco.com/1YwIZW1hWzZbnyzO04k7NceUUBVGsboUvYrl0zmY35ctkh…> Contact person: Customer Services Organized by: SMi group Collaborative 3D Printing in Medical Practice Date: 23rd to 25th February 2018 Location: Scottsdale, USA Website: http://go.evvnt.com/153859-0<http://secure-web.cisco.com/1vJLOfn_ZEbA2joEY-1byWt9shm8mQH_xn_4byDmCeCx1I-…> Contact person: Department of Radiology CME Office Organized by: Mayo Clinic Collaborative 3D Printing in Medical Practice is designed to update and introduce radiologists, surgeons, dentists, and biomedical engineers on uses of 3D printing of anatomic models. 4th International Conference on Bio-based Polymers and Composites Date: 2nd to 6th September 2018 Location: Balatonfüred, Hungary Website: http://www.bipoco2018.hu<http://secure-web.cisco.com/1fPiBV7JFwJRIl5JST2qohmSaJ53vWQeFrC9S59VXw8dys1…> Contact person: Dóra Tátraaljai Bio-based polymers and their blends, composites. Natural polymers and their modification. Natural fiber reinforced composites. Other raw materials based on natural resources. Biodegradation and environmental issues

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Benjamin Leever Seminar - Nov. 30th @ 2:00pm in MRGN 121
by Turner, Jaime J 29 Nov '17

29 Nov '17

Benjamin Leever Seminar NOVEMBER 30, 2017 2:00 PM - 3:00 PM MRGN 121 Building a Manufacturing Ecosystem for Flexible Hybrid Electronics: a Focus on Aerospace Opportunities Bio: Dr. Benjamin J. Leever, Senior Materials Engineer. Dr. Leever is currently a Senior Materials Engineer in the Air Force Research Laboratory (AFRL) Soft Matter Materials Branch. His primary roles are Advanced Development Lead and Government Chief Technology Officer of NextFlex, a $170M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. In support of AFRL's investments in Soft Matter Materials and Materials for Man-Machine Interface, Dr. Leever determines technical strategy, manages AFRL contracts, and establishes and leads industrial, academic, and governmental collaborations. Prior to assuming his current duties, Dr. Leever led a research team focused on the development and modeling of multifunctional materials for structural power applications. He also served as a program manager for Flexible Materials & Devices, contributing to the strategy for $1M in annual research & development investments while also managing programs with the industrial base. Dr. Leever began his career at AFRL in the Manufacturing Technology Division, where he managed programs related to electro-optics systems. Abstract: As advanced electronics proliferate in both the commercial and defense sectors, they continue to be largely limited to rigid form factors with bulky packaging dictated by traditional electronics manufacturing processes and fragile components. Yet for applications ranging from wireless, low-profile medical devices to smart food labels to aircraft with embedded stress sensors, there's a need for high-performance electronics that conform to the shape of our bodies, vehicles, and consumer goods. Flexible Hybrid Electronics (FHE), which combine additive manufacturing processes with flexible silicon, will enable these capabilities. To move these concepts from the lab to the manufacturing floor in the United States, the Department of Defense established NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute in 2015. Based in San Jose, CA, NextFlex is a $170M public-private partnership that is building a domestic FHE manufacturing ecosystem by developing manufacturing processes and tools with its member companies and universities, standing up an FHE manufacturing pilot line in Silicon Valley, and establishing education and workforce development programs to train tomorrow's workforce. This presentation will focus on the FHE opportunity, the NextFlex FHE manufacturing roadmaps, and NextFlex projects in areas such as device integration & packaging, modeling & design tools, and printed flexible components. In addition, the presentation will highlight opportunities for FHE to impact the Air Force, including projects focused on conformal antennas for aircraft as well as wearable performance monitors for airmen. In-house research capabilities at AFRL will be discussed, including printing and characterization facilities. Finally, several AFRL projects related to FHE will be highlighted, such as work focused on flexible Li ion batteries, novel ink development, printed structures with embedded electronics, and printed multi-layer capacitors. Jaime Turner Administrative Assistant to the Director Birck Nanotechnology Center | Room 1027 | W. Lafayette, IN Office: 765.494.3509 | Fax: 765.496.8383 | Email: jjturner(a)purdue.edu<mailto:jjturner@purdue.edu> ______________________________________________________________ [cid:image003.jpg@01D36900.DE411500]

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National Nano Device Laboratories, Taiwan (NDL) Seminar, Dec. 1st @ 11am in MRGN 129
by Turner, Jaime J 28 Nov '17

28 Nov '17

National Nano Device Laboratories, Taiwan (NDL) Seminar DECEMBER 1, 2017 11:00 AM - 12:00 PM MRGN 129 NDL Introduction: beyond more than Moore CMOS (11:00am-11:20am) Prof. Wen-Kuan Yeh, Director of National Nano Device laboratories (NDL), Taiwan NDL (National Nano Device Laboratories) is an important place to cultivate high-level technology talents for semiconductor and nano techniques in Taiwan. It has become a national open nano device process test environment, and provided a unique open experiment research environment for comprehensive turnkey consignment services. As MOSFETs are scaled down to sub-10nm and below, power consumption is the major limitation to maintain device performance well. Development of Ge NW FETs (11:20am-11:35am) Dr. Yao-Jen Lee, National Nano Device laboratories (NDL), Taiwan Germanium is attractive for the future technology node application because of its two times higher electron mobility and 4 times higher hole mobility than that of Si counterpart. . The lower band gap of Ge also allows the supply voltage scalability to satisfy the post-Si CMOS era. How-ever, the Ge MOSFET tech-nology is facing several serious challenges, including fast n-type dopant diffusion, high junction leakage, EOT scaling, Dit reduction and enormous dislocation defects in the Ge epi-layer on Si substrates because of the large lattice mismatch to Si. Herein, we propose a feasible pathway to scale the Ge MOSFET technology by using a novel diamond-shaped Ge gate-all-around (GAA) nanowire (NW) FETs. Ge Devices with Ferroelectric Hf1-xZrxO Gate Stack (11:35am-11:50am) Dr. Chun-Jung Su, National Nano Device laboratories (NDL), Taiwan Germanium (Ge) has been widely studied as a potential alternative channel material for sub-3nm technology node because of its high carrier mobility and process compatibility. In order to meet the requirements of steep subthreshold slope (SS) and low VDD operation for device scaling, the ferroelectric (FE) gate stack with negative capacitance (NC) effects has been proposed to tackle the fundamental thermionic limit of 60 mV/decade SS without causing loss to the drive current. Jaime Turner Administrative Assistant to the Director Birck Nanotechnology Center | Room 1027 | W. Lafayette, IN Office: 765.494.3509 | Fax: 765.496.8383 | Email: jjturner(a)purdue.edu<mailto:jjturner@purdue.edu> ______________________________________________________________ [cid:image001.jpg@01D3682C.D19EEEA0]

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Car key - lost?
by Totten, Mary J 22 Nov '17

22 Nov '17

A car key has been turned in to me. Please check to make sure you have not misplaced your key. If you have, please come to room 1220. Thank you, Mary Jo Totten Logistics Coordinator Birck Nanotechnology Center Rm. 1220 1205 West State Street West Lafayette, IN 47907-2057 (765)496-1173

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BNC E-news for the week of November 20
by Willison, Sheryl L 17 Nov '17

17 Nov '17

[BIRCK NANOTECHNOLOGY CENTER][http://www.purdue.edu/discoverypark/resources/toolkit/files/logo/di…] Seminars/Workshops Cell Culture Basics - 2 Days Hands-On Training Course December 11 & 12 Deadline for registration is Nov. 17, 2017 Course fee: $250 Questions Dr. Tim Kwok at kwokt(a)purdue.edu<mailto:kwokt@purdue.edu> or 765-494-6697 Bagwell X Tenth Honorary Lecture Counter-Intuitive Physics of Ballistic Transport in State of the Art Electronic Devices Michael Shur, Rensselaer Polytechnic Institute Friday, November 17 at 11:00 am - 12:00 pm Burton D. Morgan Rm 121 http://www.purdue.edu/discoverypark/birck/events/index.php?view=959 Building a Manufacturing Ecosystem for Flexible Hybrid Electronics: a Focus on Aerospace Opportunities Dr. Benjamin J. Leever, Senior Materials Engineer in the Air Force Research Laboratory (AFRL) Soft Matter Materials Branch Thursday, November 30 2:00-3:00 pm Burton D. Morgan Center 121 http://www.purdue.edu/discoverypark/birck/events/index.php?view=1155 VISION TO VALUES Imaging Analysis Workshop Thursday, November 30th 8:30 am - 3 pm Dean's Auditorium, Pfendler Hall RSVP by November 21st at bindleybioscience(a)purdue.edu<mailto:bindleybioscience@purdue.edu> See other Discovery Park's Events: http://www.purdue.edu/discoverypark/events/index.php The all user meeting is scheduled for: Wednesday, January 17th at 7:00 pm in Lily 1-105 Thursday, January 18th at 7:00 pm in Lily 1-105 All users must attend one of these two session or they will lose lab access. Please remember to bring your Birck or Purdue ID. Stephen Jurss Locking office Doors Please make sure you are locking your office doors before leaving. We are coming up on the holiday season and it is a prime time for someone to steal items from offices. Be courteous to your fellow office mates and make sure you keep your office and everything inside secure. I have instructed the custodial staff to make sure that after cleaning, to close and lock the door. If you have any questions, please contact Mary Jo at 496-1173 or tottenm(a)purdue.edu<mailto:tottenm@purdue.edu> . Status of laboratories link: http://status.iLab.agilent.com NSAC Coffee Hour Each Friday 3:30 pm in BRK Atrium https://engineering.purdue.edu/NSAC/activities/coffeehour NSAC Journal Club October 31 4:30 PM BNC Atrium Happy Thanksgiving! Enjoy time with family and friends.

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REMINDER: Bagwell Lecture - Prof. Michael Shur - TODAY at 11:00am in MRGN 121
by Turner, Jaime J 17 Nov '17

17 Nov '17

Bagwell Lecture: Professor Michael Shur NOVEMBER 17, 2017 11:00 AM - 12:00 PM MRGN 121 [https://engineering.purdue.edu/dpmanage/uploads/images/5936e80e5e08b5.47053…]<https://engineering.purdue.edu/dpmanage/uploads/images/5936e80e5e08b5.47053…> Counter Intuitive Physics of Ballistic Transport in the State-of-the-Art Electronic Devices In a small enough semiconductor devices, the electron mean free path for collisions with impurities or lattice vibrations greatly exceeds the device size. Hence, the electrons travelling with the thermal or Fermi velocity leave the active region of the device before they experience scattering. Such collisionless electron transport is called "ballistic". The electron mean free path in silicon at room temperature (on the order of 30 nm) is much greater than the 10 or 12 nm feature size of modern silicon CMOS used, for example, in the recent generations of iPhones or android phones. The current-voltage characteristics of such devices look similar to those of much longer transistors. However, the physics of the ballistic transport hiding behind this misleading similarity is very different and counter intuitive. It has important qualitative consequences for the design of the advanced transistors and integrated circuits. One new ballistic concept the concept of a "ballistic mobility". A mobility is the coefficient of proportionality between the effective drift velocity in the device channel and applied electric field. Since electrons hit contacts more often in short channel devices, the ballistic mobility is proportional to the device length, as was confirmed by numerous experimental data. At high frequencies, the electron inertia starts playing an important or even dominant role. The high frequency impedance is strongly affected by the electron inertia and by the phase delays of the opposing electron fluxes in the device channel. The waves of the electron density (plasma waves) enable the device response well into the terahertz (THz) range of frequencies. At high excitation levels, these waves are transformed into the shock waves. The rectification and instabilities of the plasma waves enable a new generation of THz and sub-THz plasmonic devices. Ultra-wide band WIFI, advanced homeland security, VLSI testing, and cancer detection are but examples of applications of this plasmonic technology. Jaime Turner Administrative Assistant to the Director Birck Nanotechnology Center | Room 1027 | W. Lafayette, IN Office: 765.494.3509 | Fax: 765.496.8383 | Email: jjturner(a)purdue.edu<mailto:jjturner@purdue.edu> ______________________________________________________________ [cid:image002.jpg@01D35EF9.4918B520]

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Bagwell Lecture - Prof. Michael Shur - Friday Nov. 17th at 11:00am in MRGN 121
by Turner, Jaime J 16 Nov '17

16 Nov '17

Bagwell Lecture: Professor Michael Shur NOVEMBER 17, 2017 11:00 AM - 12:00 PM MRGN 121 [https://engineering.purdue.edu/dpmanage/uploads/images/5936e80e5e08b5.47053…]<https://engineering.purdue.edu/dpmanage/uploads/images/5936e80e5e08b5.47053…> Counter Intuitive Physics of Ballistic Transport in the State-of-the-Art Electronic Devices In a small enough semiconductor devices, the electron mean free path for collisions with impurities or lattice vibrations greatly exceeds the device size. Hence, the electrons travelling with the thermal or Fermi velocity leave the active region of the device before they experience scattering. Such collisionless electron transport is called "ballistic". The electron mean free path in silicon at room temperature (on the order of 30 nm) is much greater than the 10 or 12 nm feature size of modern silicon CMOS used, for example, in the recent generations of iPhones or android phones. The current-voltage characteristics of such devices look similar to those of much longer transistors. However, the physics of the ballistic transport hiding behind this misleading similarity is very different and counter intuitive. It has important qualitative consequences for the design of the advanced transistors and integrated circuits. One new ballistic concept the concept of a "ballistic mobility". A mobility is the coefficient of proportionality between the effective drift velocity in the device channel and applied electric field. Since electrons hit contacts more often in short channel devices, the ballistic mobility is proportional to the device length, as was confirmed by numerous experimental data. At high frequencies, the electron inertia starts playing an important or even dominant role. The high frequency impedance is strongly affected by the electron inertia and by the phase delays of the opposing electron fluxes in the device channel. The waves of the electron density (plasma waves) enable the device response well into the terahertz (THz) range of frequencies. At high excitation levels, these waves are transformed into the shock waves. The rectification and instabilities of the plasma waves enable a new generation of THz and sub-THz plasmonic devices. Ultra-wide band WIFI, advanced homeland security, VLSI testing, and cancer detection are but examples of applications of this plasmonic technology. Jaime Turner Administrative Assistant to the Director Birck Nanotechnology Center | Room 1027 | W. Lafayette, IN Office: 765.494.3509 | Fax: 765.496.8383 | Email: jjturner(a)purdue.edu<mailto:jjturner@purdue.edu> ______________________________________________________________ [cid:image002.jpg@01D35EF9.4918B520]

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All User Meeting (Required)
by Jurss, Stephen E 14 Nov '17

14 Nov '17

All, The all user meeting is scheduled for: Wednesday January 17th at 7:00pm in lily 1-105 Thursday January 18th at 7:00pm in lily 1-105 All users must attend one of these two session or they will lose lab access. Please remember to bring your Birck or Purdue ID. Stephen Birck Safety Oficer

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3D Cell Culture for Anticancer Drug Research Workshop - December 11 & 12 2017
by Kwok, Tim 13 Nov '17

13 Nov '17

Dear Fellow Scientists, If you are interested in the 3D Cell Culture for Anticancer Drug Research Training Course, it is scheduled on December 11 & 12 2017. The workshop will include a lecture on the basics of drug testing in vitro and the different 3D cell culture systems to produce preinvasive and invasive tumors, classroom exercise for data analysis and presentation, and hands-on practical with tumors in culture based on different drug screening assays. The workshop is still opened for enrollment and the deadline for registration is November 17, 2017. If you are interested, please see details below and attached and contact me. Sincerely, Tim Kwok Facility Manager 3D Cell Culture Core (3D3C) Facility Birck Nanotechnology Center Purdue University ________________________________ [https://secure-web.cisco.com/1DCtkIAf7ON6Et0qEiIziGx6X5_p2zlkJNHS8J1nwJqJSV…]

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